Aircraft SSPC PCB Assembly With Potting for Heat-Dense Packaging
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Solution Overview
Problem
Aircraft solid state power controllers (SSPCs) face challenges with heat management and space utilization due to the separate power chip packages for individual power switches, leading to increased space requirements and limited power density, while also requiring efficient heat dissipation and mechanical stability.
Innovation Solution
A printed circuit board assembly with heat generating electronic components covered by a single insulating potting, forming a male part of a card edge connector, and using a monolithic configuration with stacked circuit boards for improved mechanical stability and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate power chip packages are used for individual power switches, then heat management is improved, but space requirements increase and power density is limited
Solution Approach 1:
Multiple separate power chip packages are merged into a single integrated power chip package containing multiple power chips mounted on a common substrate. This consolidation maintains individual heat management for each power chip while reducing the total space occupied on the printed circuit board, thereby increasing power density without compromising thermal performance.
2Temperature
If separate power chip packages are used for individual power switches, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
Multiple power chip packages are merged into one integrated package with a common substrate, reducing the number of discrete components and interconnections. This simplifies the overall device structure and assembly process while maintaining effective heat dissipation pathways for each individual power chip through the shared substrate.
3Power
If multiple separate power chip packages are mounted on the printed circuit board, then power switching capability is improved, but mechanical stability decreases
Solution Approach 1:
Multiple power chips are merged into a single integrated package mounted on the printed circuit board as one unit. This reduces the number of separate mounting locations and interconnections, thereby improving mechanical stability and reducing potential points of failure while maintaining the required power switching capability through the multiple power chips within the integrated package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for a more compact and mechanically stable circuit board assembly with enhanced heat dissipation capabilities, reducing the need for external cooling measures and optimizing space utilization.
Implementation Method 1
an insulating potting covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side
Implementation Method 2
Controlling and converting power in power semiconductors of the type described above produces significant heat in a solid state power module containing the power semiconductors
Data Source
AI summary
A printed circuit board assembly for an aircraft solid state power controller (SSPC). The assembly includes t least one printed circuit board having a top side and a bottom side. At least one of the top side and the bottom side has a surface layer made from an electrically conductive material and has a plurality of heat generating electronic circuit components mounted thereon. An insulating potting covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side, the insulating potting comprising an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner. The printed circuit board is configured to form a male part of a card edge connector in at least one peripheral region thereof.