SST-NIL Curable Composition Dispensing for High Throughput

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Solution Overview

Problem

The existing photo-nanoimprint technology has a long filling time, leading to low throughput and increased costs due to issues with leaking light causing nonfill defects and the need for costly mold modifications or precise optical systems to prevent leaking light.

Innovation Solution

A method involving a short spread time nanoimprint lithography (SST-NIL) process where a curable composition (A1) is laid on a substrate, followed by a second layer of curable composition (A2) dispensed discretely, and then sandwiched between a mold and substrate, with irradiation from the side to cure the mixture, ensuring a short filling time and high throughput without the need for costly mold modifications.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional photo-nanoimprint technology is used, then pattern formation can be achieved, but the filling time is long and throughput is low

Engineering Contradiction:
ImprovethroughputVSAvoidfilling time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The invention divides the curable composition into two separate compositions: (A1) containing a polymerizable compound with limited photopolymerization initiation capability, and (A2) containing a photopolymerization initiator. This segmentation allows the curable composition to be dispensed quickly without premature curing, and then cured uniformly after mold contact, thereby reducing filling time and increasing throughput

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention changes the chemical parameters of the curable composition by separating the polymerizable compound and photopolymerization initiator into two distinct compositions with different reactivity characteristics. Composition (A1) has low reactivity toward light irradiation while composition (A2) contains the initiator that enables rapid curing only after mold contact, optimizing both filling speed and pattern formation quality

Inventive Principle:
Principle #35Parameter changes

2Reliability

If leaking light is not controlled, then the process is simple and low cost, but nonfill defects occur

Engineering Contradiction:
Improvepattern formation accuracyVSAvoidmold modification cost
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention applies preliminary anti-action by designing composition (A1) to have limited photopolymerization initiation capability, which prevents premature curing of the curable composition before mold contact. This preliminary design eliminates the need for complex light-shielding mold modifications while ensuring reliable pattern formation, as the composition remains uncured during dispensing and only cures uniformly after the mold is in place

Inventive Principle:
Principle #9Preliminary anti-action

Solution Approach 2:

The invention uses a simple, low-cost curable composition formulation that does not require expensive mold modifications or complex optical systems to control leaking light. The chemical design of the composition itself prevents the harmful effects of leaking light, making the process simpler and more cost-effective while maintaining high pattern formation accuracy

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Manufacturing precision

If uniform curing across multiple shot regions is achieved, then manufacturing precision is improved, but process complexity increases

Engineering Contradiction:
Improveuniformity of pattern formationVSAvoidoptical system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention applies local quality by designing composition (A2) to contain the photopolymerization initiator that is selectively activated only in the regions where the mold contacts the composition. This ensures uniform curing across multiple shot regions without requiring complex optical systems, as the curing reaction is locally initiated where needed through the chemical design of the composition itself

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The SST-NIL process achieves high throughput and uniform accuracy in pattern formation across multiple shot regions on a substrate, reducing costs and minimizing nonfill defects by optimizing the curing process and composition ratios.

Implementation Method 1

a light irradiating step (4) of irradiating the mixture layer obtained by partially mixing the two kinds of curable compositions with irradiation light 206 from the side of the mold 205 to cure the layer

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Implementation Method 2

the resist 102 is filled into a groove portion on the mold 105 as indicated by the arrows 104 showing the direction in which droplets spread by the capillary phenomenon (FIG. 1DA)

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS10754244B2Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
Publication Date: 2020.08.25 CANON KK
  • US10754244B2 patent drawing
  • US10754244B2 patent drawing
  • US10754244B2 patent drawing

AI summary

A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a component (a1) serving as a polymerizable compound on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing a component (a2) serving as a polymerizable compound (a2) and a component (b2) serving as a photopolymerization initiator dropwise discretely onto the layer of the curable composition (A1), subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and then releasing the mold from the mixture layer after the curing.