Temperature Stabilized Circuitry With Insulating Sidewalls
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Solution Overview
Problem
Existing methods for temperature stabilization of circuit elements are complex and costly, requiring external heaters and stabilization circuitry, which are inefficient and expensive to implement.
Innovation Solution
An integrated circuit with thermally isolated temperature sensors and heaters that maintain specific amplifier stages at selected temperatures, using thermally insulating sidewalls to isolate heating elements from other circuit elements, allowing for precise temperature control of amplifiers and band gap reference circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If external heaters and stabilization circuitry are used for temperature stabilization, then temperature control capability is improved, but device complexity and cost increase
Solution Approach 1:
The patent merges the temperature stabilization function with the integrated circuit itself by embedding temperature sensors and heaters directly within the circuit substrate. This integration eliminates the need for separate external stabilization circuitry, thereby reducing device complexity while maintaining temperature control capability.
Solution Approach 2:
The patent introduces thermally insulating material as an intermediary between different circuit elements. This mediator enables selective thermal isolation, allowing specific portions of the circuit to be heated or cooled independently without affecting other elements, thus achieving precise temperature stabilization with minimal additional circuitry.
2Temperature
If external heaters are used for temperature stabilization, then temperature control is achieved, but power dissipation increases
Solution Approach 1:
The patent applies local quality by using thermally insulating material to create spatially selective thermal zones. This allows heaters to be applied only to specific portions of the circuit that require temperature stabilization, rather than heating the entire circuit uniformly. Consequently, power dissipation is reduced by limiting heating to only the necessary local regions.
3Measurement precision
If thermally insulating material is used to isolate circuit elements, then temperature control precision is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs thin film thermal insulating material deposited directly onto the circuit substrate. This thin film approach provides effective thermal isolation while being compatible with standard semiconductor manufacturing processes. The thin film structure is easier to manufacture than bulk insulating materials or complex thermal isolation structures, as it can be deposited using conventional thin film deposition techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves high-degree temperature stabilization of amplifiers at a lower cost by localized heating, reducing power dissipation and maintaining performance independence from ambient temperature variations.
Implementation Method 1
The temperature sensor is configured to gather an indication of temperature in the semiconductor material
Implementation Method 2
The heater is in the semiconductor material and configured to heat the portion of the amplifier based on the indication of temperature
Implementation Method 3
The thermally insulating sidewall is configured to thermally isolate the portion of the amplifier, the temperature sensor, and the heater on one side of the thermally insulating sidewall from other circuit elements on an opposing side of the thermally insulating sidewall
Data Source
Figure 1
Figure 2A~2B
Figure 2C~2D
AI summary
This disclosure relates to temperature stabilization of at least a portion of an amplifier, such as a logarithmic amplifier, and/or a band gap reference circuit. In one aspect, one or more stages of an amplifier, a heater, and a temperature sensor are included in a semiconductor material and surrounded by thermally insulating sidewalls.