Stabilized Copper Nickel Etching Solution

A stabilizing agent is introduced as an intermediary substance that mediates between the HNO3/H2O2 etching mixture and the metal ions. This stabilizing agent prevents the catalytic decomposition of H2O2 by metal ions while allowing the etching reaction to proceed, thus maintaining stable etch rates throughout the process.

The composition parameters of the etching solution are modified by adding specific stabilizing agents and adjusting the ratios of HNO3, H2O2, and other components. This parameter change transforms the unstable H2O2-based etching solution into a stable formulation that maintains consistent etching performance over time.

The etching solution is designed with multi-functional capabilities to etch both Cu and Ni layers selectively in a single process step. The solution contains a eutectic mixture of halogen-containing compounds and sulfur-containing compounds that provide different etching mechanisms for different metals, enabling one solution to perform multiple etching functions.

Multiple etching functions for different metal layers are merged into a single etching solution. The solution combines halogen-containing compounds for Cu etching and sulfur-containing compounds for Ni etching, allowing simultaneous selective etching of Cu and Ni layers in one process step rather than requiring separate etching steps.

A stabilizing agent serves as an intermediary that protects H2O2 from catalytic decomposition by metal ions. This allows H2O2 to maintain its environmentally friendly oxidizing properties while preventing the loss of etching effectiveness that would otherwise occur through decomposition.

The stabilizing agent converts the potentially harmful interaction between metal ions and H2O2 (which causes decomposition) into a beneficial situation where the etching process remains consistent and reliable throughout the process, maintaining both environmental compatibility and etching effectiveness.