Stabilized Pick-and-Place Gantry for Precise Die Alignment
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Solution Overview
Problem
The challenge in advanced semiconductor packaging lies in accurately aligning and bonding dies without compromising system throughput, particularly due to shaky suction heads in pick-and-place systems, which result in position shift errors that limit bonding density.
Innovation Solution
A pick-and-place system with a gantry and stabilizer mechanism, combined with a vision alignment camera and optics alignment system, to stabilize the suction head and reduce position shift errors through precise alignment feedback loops.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a pick-and-place system is used for die placement, then productivity is improved, but manufacturing precision deteriorates due to shaky suction heads causing position shift errors
Solution Approach 1:
The patent introduces a stabilizer as an intermediary component between the suction head and the die. The stabilizer contacts the bottom die first during the placement process, providing mechanical support and reducing shaking of the suction head, thereby decreasing position shift errors while maintaining high throughput
Solution Approach 2:
The patent implements a vision alignment camera and optics alignment system that provide real-time feedback on the position of the suction head and die. This feedback loop allows for dynamic adjustment during the placement process, compensating for position shifts and improving manufacturing precision without sacrificing productivity
2Quantity of substance
If bonding density is increased, then integration density is improved, but manufacturing precision requirements increase, exacerbating the impact of position shift errors
Solution Approach 1:
The stabilizer acts as a mechanical intermediary that reduces positioning errors, enabling tighter bonding pitches required for higher bonding density while maintaining acceptable alignment accuracy
Solution Approach 2:
The vision alignment system provides precise feedback that enables accurate alignment even at higher bonding densities, where position shift errors would normally be more critical
Data Source
AI summary
A pick-and-place system is provided. The pick-and-place system includes: a wafer holder, a gantry over the wafer holder and comprising a stabilizer extending downwardly; a primary drive mechanism connected to the gantry and configured to drive the gantry; a secondary drive mechanism located at the gantry; and a suction head, wherein the secondary drive mechanism is connected to the suction head and configured to drive the suction head.