Stabilized Meltable Polymer Filament for Additive Manufacturing
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Solution Overview
Problem
Existing additive manufacturing processes face challenges with complex geometries requiring support materials and post-processing steps, such as unpacking and heat treatment, which can be inefficient and limit the properties of the final products.
Innovation Solution
A method involving the application of a filament of at least partially melted material with specific thermal properties, allowing for processing at temperatures above the melting point without significant loss of properties, using a discharge element to apply the material onto a substrate with controlled travel speeds and nozzle geometry for uniform layer deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the material is processed at temperatures above the melting point for extended periods, then the material becomes more fluid and easier to process, but the mechanical properties and stability of the polymer deteriorate
Solution Approach 1:
The patent applies preliminary action by adding a stabilizer to the hot melt adhesive composition before processing. This stabilizer prevents degradation during the extrusion and application process, allowing the material to be processed at elevated temperatures without losing mechanical properties. The stabilizer is incorporated into the polymer matrix in advance, so it is already present when thermal stress occurs during processing.
Solution Approach 2:
The patent changes the chemical composition parameters of the hot melt adhesive by incorporating specific stabilizers (such as hindered phenols or phosphites) that alter the thermal stability characteristics. This allows the material to maintain its mechanical properties at processing temperatures that would normally cause degradation, effectively changing the temperature-stability parameter range of the material.
2Adaptability or versatility
If support materials are used for complex geometries, then manufacturing capability is improved, but the process complexity and post-processing requirements increase
Solution Approach 1:
The patent applies self-service by formulating the hot melt adhesive with inherent stabilizers and optimized rheological properties that allow it to self-support during processing without requiring additional support structures. The material's enhanced stability and controlled flow characteristics enable it to maintain structural integrity during deposition, eliminating the need for separate support material systems and their associated removal processes.
Solution Approach 2:
The patent extracts the support material requirement entirely from the manufacturing process by using a specially formulated hot melt adhesive that can be processed without supports. This removes the entire support material subsystem (application, placement, and removal) from the manufacturing workflow, simplifying the overall process while maintaining the ability to produce complex geometries.
3Productivity
If travel speed is increased during material application, then productivity is improved, but the uniformity and quality of layer deposition deteriorate
Solution Approach 1:
The patent applies dynamics by formulating the hot melt adhesive with rheological modifiers that allow the material's viscosity to dynamically adapt to processing conditions. The stabilized polymer composition maintains optimal flow characteristics even at high extrusion speeds, enabling fast travel rates while preserving layer uniformity. The stabilizer prevents viscosity changes that would otherwise occur due to thermal degradation during high-speed processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of objects with improved mechanical properties and reduced post-processing requirements, allowing for higher travel speeds and maintaining desired properties of the meltable polymer, including increased storage modulus and heat resistance of the bond.
Implementation Method 1
The meltable polymer has a melting point (DSC, differential scanning calorimetry; 2nd heating at a heating rate of 5 °C/min.) in a range from ≥ 35 °C to ≤ 150 °C
Implementation Method 2
When it solidifies, a solid object is formed
Data Source
AI summary
The invention relates to a method for applying a material containing a meltable polymer, comprising the step of applying a filament of the at least partially molten material that contains a meltable polymer from a discharge opening of a discharge element onto a first substrate. The meltable polymer has the following properties: a melting point (DSC, differential scanning calorimetry; 2nd heating run at a heating rate of 5°C/min) in a range of ≥ 35°C to ≤ 150°C; and a glass transition temperature (DMA, dynamic-mechanical analysis according to DIN EN ISO 6721-1:2011) in a range of ≥ −70°C to ≤ 110°C; the filament having an application temperature of ≥ 100°C above the melting point of the meltable polymer for ≤ 20 minutes during the application process. Free NCO groups are furthermore present in the material that contains the meltable polymer.