Temperature Stabilizer Actuator for Wafer Scratch Prevention
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Solution Overview
Problem
Semiconductor manufacturing apparatuses face challenges in preventing scratches on wafers during pre-alignment processes due to temperature stabilization, and existing solutions often require stopping operations to minimize scratches, which can also lead to inefficient cooling.
Innovation Solution
A semiconductor manufacturing apparatus with a temperature stabilizer, chuck, and actuators that allow for real-time adjustment of the distance between the wafer and the temperature stabilizer using proximity and pressure sensors, enabling precise temperature control and alignment while preventing scratches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the temperature stabilizer maintains close contact with the wafer for effective cooling, then cooling efficiency is improved, but scratches are formed on the wafer back surface
Solution Approach 1:
The temperature stabilizer is designed with movable elements that can dynamically adjust the contact pressure and contact area with the wafer back surface. During high-speed rotation, the stabilizer maintains minimal contact to prevent scratches, while during stationary or low-speed periods, it increases contact pressure for effective cooling, thus resolving the contradiction between cooling efficiency and scratch prevention
Solution Approach 2:
The system changes the physical parameters of the temperature stabilizer-wafer interface by adjusting contact pressure and contact area based on operational conditions. By varying these parameters dynamically, the system achieves effective cooling when needed while preventing scratches during critical operations, thereby resolving the technical contradiction
2Productivity
If the semiconductor manufacturing apparatus operates continuously for productivity, then production efficiency is improved, but scratches are formed due to temperature stabilization requirements
Solution Approach 1:
The temperature stabilizer operates continuously without requiring the apparatus to stop, maintaining optimal cooling throughout the pre-alignment and exposure processes. The dynamic adjustment mechanism ensures continuous useful action (cooling) while adapting contact levels to prevent scratches during different operational phases, thus maintaining high productivity without compromising wafer quality
Solution Approach 2:
The system dynamically adapts the temperature stabilizer's contact characteristics during continuous operation, switching between high-contact cooling mode and low-contact protection mode based on real-time operational requirements. This dynamic behavior enables continuous production while preventing scratches, resolving the contradiction between productivity and wafer protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient pre-alignment and temperature control of wafers during semiconductor manufacturing, reducing the risk of scratches and maintaining optimal cooling efficiency, thereby shortening process times and enhancing production efficiency.
Implementation Method 1
cooling the wafer using the compressed air from the compressed air provider of the temperature stabilizer
Implementation Method 2
an actuator, connected to the temperature stabilizer, to move the temperature stabilizer in a third direction crossing to the first and second directions
Data Source
AI summary
A semiconductor manufacturing apparatus includes a temperature stabilizer, a chuck, an actuator, and a controller. The temperature stabilizer is on a plane defined by a first direction and a second direction crossing the first direction. The chuck supports and rotates a wafer and passes through a center of the temperature stabilizer. The actuator is connected to the temperature stabilizer and moves the temperature stabilizer in a third direction crossing to the first and second directions. The controller controls driving of the actuator.