Stack Chip Package Layout for Passive Element Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing stack chip packages face challenges in effectively integrating passive elements within a restricted area, which can lead to reduced signal and power quality.
Innovation Solution
The proposed stack chip package design includes a package substrate with alternating first and second stack structures, each featuring semiconductor chips stacked with concave and protruding portions. This configuration allows for efficient integration of passive elements outside the stack structures, optimizing the integration area and improving signal and power quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If semiconductor chips are stacked densely on the package substrate to increase integration, then the footprint area is reduced, but the area available for passive element integration is insufficient
Solution Approach 1:
The package substrate is divided into multiple regions: first and second stack structure regions for active semiconductor chips, and a separate passive element integration region. This spatial segmentation allows dense stacking of active chips while dedicating specific areas for passive elements, resolving the conflict between footprint reduction and passive element integration area.
Solution Approach 2:
The package structure utilizes three-dimensional stacking of semiconductor chips vertically on the package substrate, freeing up horizontal plane area. This dimensional transition from 2D to 3D arrangement enables sufficient space for passive elements to be integrated on the package substrate without increasing the overall footprint area.
2Area of moving object
If passive elements are integrated in the restricted area, then the footprint area is reduced, but the signal and power quality deteriorates
Solution Approach 1:
Different regions of the package substrate are assigned different functions with optimized characteristics: the passive element integration region is positioned and sized to provide adequate signal and power quality, while the stack structure regions are optimized for active chip integration. This local optimization ensures that passive elements receive sufficient space for proper electrical performance while maintaining overall compactness.
3Area of stationary object
If the stack structure is arranged with alternating concave and protruding portions, then the passive element integration area is secured, but the manufacturing complexity increases
Solution Approach 1:
The stack structure is segmented into modular units with standardized concave and protruding portions. Each semiconductor chip in the stack is designed with complementary features that interlock, creating a systematic pattern rather than arbitrary complexity. This modular segmentation makes the complex structure more manageable and suitable for standardized manufacturing processes.
Data Source
AI summary
A stack chip package includes a first stack structure, a second stack structure and a passive element. The first and second stack structures include a plurality of semiconductor chips stacked on a package substrate, respectively. The first stack structure has a first sidewall portion and a second sidewall portion. The plurality of the semiconductor chips in the first stack structure are stacked on the first sidewall portion to form a first concave portion and a first protrusion alternately arranged. The second stack structure has a third sidewall portion and a fourth sidewall portion. The third sidewall portion faces the first sidewall portion. The plurality of the semiconductor chips in the second stack structure are stacked on the third sidewall portion to form a second concave portion and a second protrusion alternately arranged. The first concave portion faces the second protrusion. The first protrusion faces the second concave portion.