Stack Design Implant Device Modular Nerve Stimulation

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Solution Overview

Problem

Conventional implant devices for functional electrical stimulation (FES) lack flexibility and durability due to structural limitations and susceptibility to lead damage from movement, restricting their application range.

Innovation Solution

A modular implant device with a stack design comprising standardized modular elements, including strain relief and circuit modules, made from biocompatible titanium alloys, with flexible electrode arrangements and hermetic fixation systems, enhancing durability and manufacturing efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional implant devices use fixed structural design with lead electrodes, then the device can provide electrical stimulation function, but the device is susceptible to lead damage from movement and lacks flexibility in application

Engineering Contradiction:
ImprovedurabilityVSAvoidapplication range
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The implant device is divided into modular components including a housing module, circuit board module, and electrode module that can be independently configured and assembled. This segmentation allows the device to be customized for different applications while maintaining structural integrity and reducing lead damage risks through standardized connections.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The standardized housing and circuit board modules can support multiple electrode configurations and stimulation patterns, enabling a single device platform to serve multiple therapeutic applications. The universal interface design allows different electrode arrays to be attached to the same housing module.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If conventional implant devices use complex manufacturing processes to achieve durability, then the device reliability improves, but the manufacturing complexity and cost increase

Engineering Contradiction:
Improvedevice durabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The device is manufactured as separate modules (housing, circuit board, electrodes) that can be produced using standardized processes and then assembled. This reduces manufacturing complexity compared to producing a single complex integrated device, while maintaining reliability through modular quality control.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple functional components are combined into integrated modules - the circuit board is housed within the housing module with standardized electrode interfaces. This merging simplifies the overall assembly process while ensuring reliable connections between components.

Inventive Principle:
Principle #5Merging (Combining)

3Adaptability or versatility

If the device uses flexible electrode arrangements for versatile applications, then the adaptability improves, but the structural complexity and manufacturing difficulty increase

Engineering Contradiction:
Improveelectrode arrangement flexibilityVSAvoidstructural complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The electrode system is segmented into separate electrode arrays that can be independently configured and attached to the housing module. This allows flexible electrode arrangements for different applications without increasing the complexity of the core housing and circuit board structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The electrode arrays can be arranged in different spatial configurations (e.g., linear, grid, or three-dimensional patterns) while maintaining the same basic module interface. This dimensional flexibility allows versatile electrode positioning without increasing structural complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20240024689A1Stack design implant device
Publication Date: 2024.01.25 NYXOAH
  • US20240024689A1 patent drawing
  • US20240024689A1 patent drawing
  • US20240024689A1 patent drawing

AI summary

A modular implant device configured for stimulation of at least one nerve or muscle in a body of a subject comprises: a housing; and at least one electrical lead, and/or at least one stimulation electrode; wherein the at least one electrical lead is partly disposed on the housing, and wherein the housing comprises modular elements, the modular elements being arranged in a stack. A system for electrical nerve stimulation comprises a network of at least two modular devices configured for implantation inside a body of a subject according to one of the preceding claims, wherein each modular device is electrically connected to at least one other modular device through electrical leads.