Stack Frame for Electrical Connections and Fabrication Method
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Solution Overview
Problem
Conventional lead frame packaging processes are costly, limited in design flexibility, and lack modular capability, with poor area design and reliance on plastic molding, which restricts product size reduction and increases development costs.
Innovation Solution
A metallic stack frame with a conductive pattern is formed by removing portions of a metallic substrate to create pins for electrical connections, allowing direct connection of conductive elements without additional PCBs, using techniques like wire bonding or electroplating, and incorporating a filling layer to reduce costs and enhance design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional lead frame packaging process is used, then electrical connections can be established, but manufacturing cost increases and development work becomes more complex
Solution Approach 1:
The patent extracts the essential function of electrical connection from the conventional plastic-molded lead frame structure and implements it using a simplified metallic frame with exposed pins. By removing the plastic molding and associated complex processes, the invention maintains electrical connection reliability while significantly reducing manufacturing cost and development complexity.
Solution Approach 2:
The patent employs a cost-effective metallic frame structure that eliminates expensive plastic molding processes. The simplified frame design uses basic metallic materials and straightforward fabrication methods, replacing costly molded components with more economical alternatives that achieve the same functional purpose.
2Reliability
If plastic molding is used for encapsulation, then device protection is achieved, but product size cannot be reduced and design flexibility is limited
Solution Approach 1:
The patent removes the plastic molding encapsulation entirely, exposing the metallic frame pins for direct electrical connection. This extraction eliminates the bulk added by molding while maintaining essential device protection through the metallic frame structure itself, thereby reducing product size and increasing design flexibility.
Solution Approach 2:
The patent transitions from a three-dimensional molded encapsulation structure to a more compact configuration where the metallic frame provides both structural support and electrical connection in an integrated manner, reducing the overall volume required for device protection and packaging.
3Reliability
If conventional lead frame structure is used, then electrical connections are established, but area design capability is poor and product size doesn't shrink
Solution Approach 1:
The patent segments the electrical connection function into discrete metallic pins that can be independently positioned and configured. This segmentation allows for optimized area utilization and compact layout design, enabling better space efficiency and smaller product footprint compared to conventional lead frame structures.
Solution Approach 2:
The patent reconfigures the electrical connection architecture from a planar lead frame layout to a three-dimensional metallic frame structure with pins extending in multiple directions. This dimensional change enables more efficient use of space and allows for compact packaging that reduces product footprint while maintaining full electrical connection capability.
4Reliability
If conventional packaging process is used, then single device packaging is achieved, but modular capability is lacking
Solution Approach 1:
The patent designs the metallic frame structure to serve multiple functions: structural support, electrical connection, and modular integration. The standardized pin configuration and open frame architecture enable the same basic structure to package different devices and configurations, providing universal applicability and modular capability across various applications.
Solution Approach 2:
The patent creates a dynamic and flexible packaging solution where the metallic frame can be easily configured and reconfigured for different device types and arrangements. The modular design allows for adaptive packaging that can accommodate changing requirements, enabling versatile applications from single-device to multi-device configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves heat dissipation and electrical conductance, reduces impedance, and enables more efficient packaging with smaller sizes and versatile applications for active and passive components, eliminating the need for additional molding devices and processes.
Implementation Method 1
conductive wires (by film process, printing process, electroplating)
Data Source
AI summary
A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.