Stack Manufacturing Apparatus for Precise Layer Separation

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Solution Overview

Problem

Existing technologies face challenges in efficiently forming a separation starting point for surface layers of processed members in semiconductor and display devices, particularly in forming a remaining portion without damaging the underlying layers, and in manufacturing stacks with precise separation and attachment of layers.

Innovation Solution

A device and method involving a stage, cutter, head portion, arm portion, and moving mechanism to cut the processed member while leaving part of it intact, along with a camera and image processing for verification, and a stack manufacturing apparatus that includes units for forming, separating, attaching, and transporting the processed member layers with adhesive layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a cutter is used to cut the processed member to form a separation starting point, then the surface layer can be separated to form a remaining portion, but the underlying layers may be damaged

Engineering Contradiction:

Improveseparation starting point formation precisionVSAvoiddamage to underlying layers

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

An adhesive layer is introduced as an intermediary between the processed member and the support. This adhesive layer enables controlled separation at the interface between the processed member and adhesive, rather than cutting through the processed member itself, thereby preventing damage to underlying layers while still achieving precise separation starting point formation

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces the mechanical cutting system with a chemical bonding system. Instead of using a cutter to mechanically separate layers, an adhesive layer is applied and then selectively removed or deactivated, allowing non-contact separation that eliminates mechanical damage to underlying structures

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If a complex stack manufacturing apparatus is used to achieve precise separation and attachment, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:

Improvelayer separation and attachment precisionVSAvoidapparatus structure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines multiple functions into integrated units: the attachment unit performs both adhesive application and bonding operations, the separation unit integrates detection and separation actions, and the transport unit combines conveyance with positioning. This functional integration reduces overall apparatus complexity while maintaining manufacturing precision

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

Key components are designed with multi-functionality: the attachment unit can handle different adhesive types and bonding conditions, the separation unit can detect and separate various layer configurations, and the transport unit can accommodate different processed member sizes. This universality reduces the need for multiple specialized components, simplifying the overall apparatus

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS9764488B2Device for forming separation starting point, stack manufacturing apparatus, and method for forming separation starting point

Publication Date: 2017.09.19 SEMICON ENERGY LAB CO LTD

AI summary

A device for forming a separation starting point that allows separation of a surface layer of a processed member to form a remaining portion is provided. A manufacturing device of a stack including a support and a remaining portion of a processed member whose surface layer is separated is provided. The device for forming the separation starting point includes a stage that supports the processed member, a cutter that faces the stage, a head portion that supports the cutter, an arm portion that supports the head portion, and a moving mechanism that relatively moves the cutter to the stage.