Stack Molding Machine Multi-Layer Substrate Injection

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Solution Overview

Problem

Conventional mold structures for encapsulating semiconductor products have low productivity and risk damage during demolding due to the substrate being molded in a single layer between upper and lower molds.

Innovation Solution

A stack molding machine design that allows multiple substrates to be molded simultaneously by stacking them and using multiple injection ports, with symmetrical runners and gates in the upper and lower molds, and intermediate plates to control resin flow and molding per layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a single substrate is molded between upper and lower molds, then the molding structure is simple, but productivity is low

Engineering Contradiction:

Improvenumber of substrates molded per processVSAvoidmold structure complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The mold structure is segmented into multiple independent molding systems: upper mold with first runner and first gate, lower mold with second runner and second gate, allowing simultaneous molding of multiple substrates at different positions without requiring a single complex injection system

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention transitions from single-layer substrate molding to multi-layer stacked substrate molding, utilizing the vertical dimension to stack substrates between upper and lower molds, thereby increasing productivity without proportionally increasing device complexity

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If a single substrate is molded between upper and lower molds, then the mold structure is simple, but molding can be controlled per layer

Engineering Contradiction:

Improvenumber of substrates molded per processVSAvoidmolding control per layer

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The injection system is divided into separate independent paths: first runner connected to first gate in upper mold, and second runner connected to second gate in lower mold, enabling independent control of resin injection for each substrate layer

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The mold structure incorporates dynamic control capabilities through separate injection ports and runners that can be independently activated, allowing flexible control over which substrate layers receive resin injection based on production requirements

Inventive Principle:

Principle #15Dynamics

3Productivity

If substrates are stacked for multi-layer molding, then productivity increases, but damage during demolding occurs

Engineering Contradiction:

Improvenumber of substrates molded per processVSAvoidmolding integrity during demolding

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The mold is segmented into upper and lower independent molding systems with separate runners and gates, allowing each substrate layer to be molded and demolded independently, preventing damage that would occur with forced single-unit demolding of stacked substrates

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Instead of molding all substrates as a single unit and then demolding together (which causes damage), the invention inverts the approach by using separate injection paths that allow controlled, independent resin flow and subsequent independent demolding of each layer

Inventive Principle:

Principle #13The other way round (Inversion)

4Ease of manufacture

If multiple injection ports are used for multi-layer molding, then molding per layer can be controlled, but device complexity increases

Engineering Contradiction:

Improvemolding control per layerVSAvoidnumber of injection ports and runners

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

Each injection port system (first runner/first gate in upper mold, second runner/second gate in lower mold) is designed as a universal module that can independently service its associated substrate layer, allowing the same basic injection mechanism to be replicated rather than creating a complex customized system

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS12138832B2Stack molding machine

Publication Date: 2024.11.12 ITM SEMICON CO LTD

AI summary

Provided is a stack molding machine including an upper mold having formed therein a first runner and a first gate serving as a path of a resin material, a first intermediate plate provided under and combined with the upper mold, and having formed therein a first molding connected to the first gate to mold at least a portion on a first substrate placed under the first intermediate plate, a dummy plate provided under and spaced a certain distance apart from the first intermediate plate, a second intermediate plate provided under the dummy plate, and having formed therein a second molding connected to a second gate to mold at least a portion under a second substrate placed under the dummy plate, and a lower mold having formed therein a second runner and the second gate serving as a path of the resin material, and combined with the second intermediate plate.