Stack Package Resin Reflow Joining to Eliminate Voids
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Solution Overview
Problem
Current package stacking techniques for package-on-package devices are complex and time-consuming, often resulting in stack packages with lower reliability due to voids and gaps formed during the manufacturing process.
Innovation Solution
A method involving the attachment of semiconductor devices and conductive connection terminals on substrates, followed by the application of a molding resin material layer, which is reflowed and hardened to securely join the substrates while filling the gaps between them, ensuring a reliable electrical connection without voids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser drilling and solder ball connectors are used to form holes in the mold layer, then electrical connections between packages are achieved, but the manufacturing process becomes highly complicated and time-consuming
Solution Approach 1:
The patent combines the molding resin application and electrical connection formation into a single integrated process. The conductive connection terminals are formed within the molding resin material itself during the molding process, eliminating the need for separate laser drilling and solder ball placement steps. This merging of operations simplifies the manufacturing process while maintaining reliable electrical connections between stacked packages.
2Reliability
If laser drilling and solder ball connectors are used to form holes in the mold layer, then electrical connections between packages are achieved, but the manufacturing time increases relatively long
Solution Approach 1:
The conductive connection terminals are formed within the molding resin material before the packages are stacked. By preparing the electrical connection structure in advance during the molding process, the patent eliminates the need for time-consuming post-molding operations such as laser drilling and solder ball placement, thereby significantly reducing total manufacturing time while ensuring reliable electrical connections.
3Productivity
If conventional package stacking methods are used, then packages can be stacked, but voids and gaps are formed reducing reliability
Solution Approach 1:
The patent applies conductive connection terminals at specific locations within the molding resin material to ensure complete filling and eliminate voids. The molding resin is formulated and applied to locally fill gaps between stacked packages, with conductive terminals positioned to ensure reliable electrical connections. This localized quality control ensures both high reliability and efficient stacking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, reduces production time, and enhances the reliability of stack packages by ensuring complete filling of gaps and eliminating voids, leading to improved electrical connectivity and structural integrity.
Implementation Method 1
compressing the first package substrate and the second package substrate while reflowing the molding resin material layer
Implementation Method 2
reflowing the molding resin material layer
Implementation Method 3
compressing the first package substrate and the second package substrate while reflowing the molding resin material layer
Implementation Method 4
hardening the reflowed molding resin material layer
Data Source
AI summary
A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.