Stack Package Supporting Substrate for High I/O Signal Integrity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-performance semiconductor packages require advanced techniques to efficiently connect increasing numbers of input/output (I/O) terminals between semiconductor dies and package substrates, as traditional methods struggle to manage the growing data processing demands effectively.
Innovation Solution
The stack package design incorporates a supporting substrate mounted on the package substrate using connection bumps, with redistributed line (RDL) patterns and bonding wires to establish multiple channels for electrical connections between semiconductor dies and the package substrate, allowing for improved signal routing and integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of I/O terminals is increased to process more data at high speed, then data processing capability is improved, but the complexity of electrical connection techniques worsens
Solution Approach 1:
The patent divides the electrical connection system into multiple independent channels, each handling specific I/O terminals. The package substrate is segmented into multiple connection regions with separate bonding wires and RDL patterns, allowing parallel data processing while maintaining manageable connection complexity through modular organization
Solution Approach 2:
The patent transitions from planar connections to three-dimensional stacked architecture. Multiple semiconductor dies are vertically stacked and connected through vertical RDL patterns and bonding wires, adding the vertical dimension to electrical connections. This enables increased I/O capacity without proportionally increasing lateral connection complexity
2Quantity of substance
If multiple semiconductor dies are stacked to increase I/O terminals, then the number of connection points increases, but signal integrity maintenance becomes more difficult
Solution Approach 1:
The patent introduces RDL patterns as intermediary connection structures between bonding wires and semiconductor die terminals. These RDL patterns act as signal conditioning intermediaries that distribute and stabilize signals across multiple connection points, maintaining signal integrity while enabling increased numbers of I/O terminals through the stacked die architecture
Data Source
AI summary
A stack package includes a supporting substrate that supports first and second semiconductor dies. The supporting substrate is disposed on a package substrate and is supported by first and second connection bumps. Redistributed line (RDL) patterns are disposed on the supporting substrate to electrically connect the first semiconductor die to the first and second connection bumps. The second semiconductor dies are connected to the package substrate by bonding wires.