Stack Packages With Bridge Dies For Isolated Electric Paths
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Solution Overview
Problem
Current semiconductor packages face challenges in achieving high density and high-speed operation while maintaining a small form factor, particularly in realizing reduced thickness, due to limitations in chip stack technology and wafer-level chip stack package development.
Innovation Solution
The proposed solution involves a stack package configuration with multiple sub-packages, each comprising bridge dies and semiconductor dies spaced apart, connected by vertical interconnectors and redistribution lines, allowing for vertical stacking and electrical isolation to create separate electric paths, thereby enabling efficient data transmission and increased memory capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor dies are vertically stacked to increase memory capacity and bandwidth, then the memory capacity and operating speed are improved, but the package thickness increases
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional vertical stacking of multiple sub-packages, each containing bridge dies and semiconductor dies arranged in multiple layers. This dimensional change allows increased memory capacity within a smaller footprint while managing thickness through optimized vertical interconnection structures including through-silicon vias and redistribution layers that enable compact signal routing.
2Reliability
If bridge dies are used to provide separate electric paths for data transmission, then signal noise is reduced and bandwidth is improved, but the device complexity increases
Solution Approach 1:
The patent segments the package into multiple sub-packages, each containing bridge dies that act as independent intermediate connection structures. These bridge dies create separate electric paths for data transmission between stacked semiconductor dies, isolating signal routes to reduce noise and crosstalk. The segmentation allows complex high-speed signaling to be divided into manageable independent channels while maintaining overall system reliability.
Solution Approach 2:
The bridge dies serve as intermediary structures between stacked semiconductor dies, providing dedicated vertical interconnectors and redistribution lines that mediate data transmission. These intermediary bridge dies enable separate electric paths without requiring direct complex interconnections between all semiconductor die pairs, simplifying the overall interconnection architecture while maintaining signal integrity through isolated transmission channels.
3Productivity
If vertical interconnectors are densely packed to increase I/O capacity, then bandwidth is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs preliminary alignment structures including alignment marks and standardized via patterns formed during the semiconductor fabrication process. The bridge dies and semiconductor dies are prepared with pre-defined interconnector locations and redistribution layer patterns before stacking. This preliminary action ensures that when sub-packages are vertically stacked, the through-silicon vias and interconnectors align precisely without requiring ultra-precise manual positioning, thereby enabling dense I/O packaging while maintaining manufacturability.
Data Source
AI summary
A stack package includes a plurality of sub-packages vertically stacked. Each of the sub-packages includes a bridge die having a plurality of vertical interconnectors and a semiconductor die. A first group of vertical interconnectors disposed in a first bridge die included in a first sub-package of the sub-packages and other vertical interconnectors connected to the first group of vertical interconnectors constitute a first electric path, and a second group of vertical interconnectors disposed in a second bridge die included in a second sub-package of the sub-packages and other vertical interconnectors connected to the second group of vertical interconnectors constitute a second electric path. The first and second electric paths are electrically isolated from each other and disposed to provide two separate electric paths.