Stack Packaging System With Shaped Encapsulant Cavity
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in simplifying manufacturing processes, reducing time to market, minimizing electrical components on circuit boards, and enhancing functionality while maintaining reliability and cost-effectiveness.
Innovation Solution
The method involves creating a stack packaging system with a stack board, a device connected over it, a stack encapsulant with a cavity and shaped perimeter sides, and a stack adhesive, which allows for reduced package profile height and increased clearance to prevent shorts and interference, enabling efficient manufacturing and cost savings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional integrated circuit packaging is used, then electrical connections and components are established, but the package profile height is large and electrical interference occurs
Solution Approach 1:
The patent transitions from traditional lateral electrical connections to vertical stacking architecture, moving components and interconnects into the third dimension. This dimensional change reduces the horizontal footprint and package profile height while maintaining electrical connection functionality through vertical interconnect access structures that penetrate encapsulant layers.
Solution Approach 2:
The patent implements nested packaging where multiple integrated circuit devices and interconnect structures are embedded within encapsulant layers. Devices are nested vertically with lower devices positioned beneath upper devices, and interconnect structures are nested within encapsulant material, creating a compact stacked configuration that reduces overall package height.
2Adaptability or versatility
If more electrical parts and complex circuitry are added to integrated circuit packages, then functionality increases, but manufacturing complexity and time to market increase
Solution Approach 1:
The patent creates a universal stacked packaging platform that can accommodate multiple different integrated circuit devices in a standardized vertical configuration. The same encapsulant and interconnect structure serves multiple functions: mechanical support, electrical isolation, and signal transmission, reducing the need for device-specific packaging variations and simplifying manufacturing across different product lines.
Solution Approach 2:
The patent divides the integrated circuit system into discrete stackable modules (devices, encapsulants, interconnects) that can be independently manufactured and tested before assembly. This segmentation allows parallel manufacturing of individual components, reducing overall manufacturing complexity and enabling faster time to market while maintaining high functionality through modular composition.
3Volume of moving object
If package size is reduced, then product compactness improves, but clearance for connections and heat dissipation decreases
Solution Approach 1:
The patent resolves the clearance problem by transitioning electrical connections from lateral routing to vertical routing through the stack. Interconnect structures extend vertically through encapsulant layers to establish electrical connections between stacked devices, eliminating the need for lateral clearance space and enabling compact package volume while maintaining adequate electrical isolation and connection capability.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a stack board; connecting a device over the stack board; forming a stack encapsulant having a cavity and a pedestal over the device and having a shaped perimeter side from a pedestal surface of the pedestal to the stack board; and attaching a stack adhesive to a base package and the pedestal, the cavity and the shaped perimeter side providing a space for connections to the stack board.