Stack-PCB Midplane Architecture for Heat Dissipation and Rigidity
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Solution Overview
Problem
Existing PCB-based designs in computing devices face challenges with heat dissipation and structural integrity, leading to bulky and inefficient packaging, which hinders performance and increases noise levels due to complex and messy configurations.
Innovation Solution
A stack printed circuit board (stack-PCB) architecture that incorporates a heat spreader acting as an isothermal core and structural mid-frame, allowing for multiple layers of PCBs and complementary elements on either side, with interposers for reduced connector count and enhanced heat distribution, eliminating the need for additional framing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If metal frames are employed to provide structural stability, then structural integrity is improved, but device weight and volume increase
Solution Approach 1:
The patent combines the structural frame function with the heat spreader into a single integrated component. The heat spreader is designed to serve dual purposes: it acts as both a thermal management component and a structural mid-frame, eliminating the need for separate metal framing while maintaining structural integrity and reducing overall device weight.
2Reliability
If traditional PCB mounting with flex circuits is used, then electrical connections are achieved, but packaging complexity and device volume increase
Solution Approach 1:
The patent extracts and eliminates the flex circuit intermediary from the traditional PCB mounting system. By implementing direct rigid-to-rigid PCB mounting, the complex flex circuit packaging is removed, simplifying the overall structure while maintaining reliable electrical connections between PCB layers.
3Power
If traditional PCB designs are used, then electrical functionality is achieved, but heat dissipation capability is insufficient
Solution Approach 1:
The patent merges the heat spreader with the structural frame into a single integrated component. This unified heat spreader/frame structure provides superior thermal management capabilities while maintaining structural support, enabling effective heat dissipation for high-power processing components without requiring additional framing.
Solution Approach 2:
The heat spreader is designed to perform multiple functions simultaneously: it serves as a thermal management component for heat dissipation, a structural mid-frame for mechanical support, and a mounting platform for PCBs and complementary elements. This multi-functionality enables effective heat management while reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables higher volumetric efficiency, improved heat dissipation, reduced junction temperatures, and increased structural rigidity, allowing for more compact, lightweight designs with enhanced processing power and reduced noise, while maintaining isothermal conditions and simplifying manufacturing.
Implementation Method 1
an heat spreader acting as an isothermal core... improved heat dissipation... maintaining isothermal conditions
Data Source
AI summary
A multi-board system for an electronic device that includes an heat spreader between at least two boards. In examples, the multi-board system may include a stack-PCB architecture on one side of the heat spreader and one or more boards on an opposite side of the heat spreader from the stack-PCB. The heat spreader may comprise a vapor chamber and/or include a graphite layer or core to transfer heat along a length of the heat spreader.