Stack-Type Semiconductor Package Socket Testing

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Solution Overview

Problem

The existing stack-type semiconductor package testing methods are inefficient, as they require disassembly and reassembly of individual packages to identify defects, leading to increased repair costs and time, and it is difficult to determine which package is defective within the stack.

Innovation Solution

A stack-type semiconductor package socket and test system that allows individual packages to be tested in a similar environment to the stacked state by using a first package connection portion for the lowermost package leads and a second package connection portion for odd-numbered and even-numbered package pads and leads, with electrical connections mimicking the stacked configuration, enabling simultaneous testing of the whole package and individual components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If individual packages are physically stacked for testing, then the actual stacked state can be tested, but disassembly and reassembly are required to identify defective packages, increasing repair time and costs

Engineering Contradiction:

Improvetesting accuracyVSAvoidrepair time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The socket is divided into multiple independent package connection portions (first package connection portion for lowermost package, second package connection portion for intermediate packages). Each connection portion can independently connect to and test individual packages through electrical connections, allowing defect isolation without physical disassembly of the stacked structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The socket acts as an intermediary device between the test system and the stacked packages. It provides electrical connection paths that mimic the stacked configuration, enabling the test system to identify defective packages through electrical signaling without requiring physical manipulation of the package stack.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If individual packages are physically stacked for testing, then the actual stacked state can be tested, but it is difficult to determine which specific package is defective

Engineering Contradiction:

Improvetesting accuracyVSAvoiddefect identification difficulty

Core Design Contradiction:

ReliabilityVSDifficulty of detecting and measuring

Solution Approach 1:

The socket structure segments the electrical connection paths for each package. The first package connection portion connects to the lowermost package leads, while the second package connection portion connects to intermediate package pads and leads. This segmentation allows the test system to trace defects to specific packages through the organized electrical connection structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The socket creates an electrical copy of the stacked package configuration. By providing connection portions that replicate the electrical interconnections of the actual stack (lowermost package leads connecting to intermediate package pads), the socket enables defect detection without requiring the physical stack to be assembled.

Inventive Principle:

Principle #26Copying

3Ease of manufacture

If traditional testing methods are used, then simple testing equipment can be employed, but disassembly and reassembly of packages are required, increasing repair costs

Engineering Contradiction:

Improvetesting equipment simplicityVSAvoidrepair cost

Core Design Contradiction:

Ease of manufactureVSEase of repair

Solution Approach 1:

The socket provides multi-functionality by serving as both a physical support structure for the packages and an electrical connection system for testing. The first and second package connection portions together enable complete stack testing while allowing individual package identification, eliminating the need for repeated disassembly and reassembly during repair operations.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS7436199B2Stack-type semiconductor package sockets and stack-type semiconductor package test systems

Publication Date: 2008.10.14 SAMSUNG ELECTRONICS CO LTD

AI summary

A stack-type semiconductor package socket may include: a first package connection portion for connection with leads of a lowermost package of a stack-type semiconductor package; a second package connection portion for connection between pads of an odd-numbered package and leads of an even-numbered package, wherein the odd-numbered package and the even-numbered package are adjacent to each other; a lower case for fixing the first package connection portion; and an upper case for fixing the second package connection portion. A stack-type semiconductor package test system may include: a stack-type semiconductor package socket that includes first and second package connection portions; a printed circuit board electrically connected to leads of the lowermost package through the first package connection portion; and a test controller for receiving, outputting, or receiving and outputting signals from, to, or from and to the stack-type semiconductor package through the PCB and the stack-type semiconductor package socket.