Stackable Air Impeding Structures with Snap-in Tabs
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Solution Overview
Problem
Unpopulated processing unit sockets in computing devices lead to inadequate heat dissipation due to lack of air flow impedance, and existing static air flow impedance structures are not adaptable to varying thermal needs of different computing devices.
Innovation Solution
Stackable air impedance structures with snap-in tabs and recessed features that allow for adjustable height and engagement with socket covers, enabling customizable air flow impedance to match specific thermal requirements of each device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a static air impedance structure is used for unpopulated sockets, then the structure is simple and easy to manufacture, but the thermal compatibility cannot be adapted to different computing devices with varying power demands
Solution Approach 1:
The air impedance structure is divided into multiple stackable segments with snap-in tabs and engagement features. Each segment can be independently manufactured and then stacked to achieve different total heights, allowing adaptation to various thermal requirements while keeping individual segment manufacturing simple
Solution Approach 2:
The structure transitions from a static fixed-height design to a dynamic adjustable-height design through the snap-in tab engagement mechanism. Users can stack different numbers of segments to create variable air impedance levels, making the system adaptable to different computing device configurations
2Temperature
If the air impedance structure is made taller to increase air flow impedance, then heat dissipation improves, but the device height increases and may not fit all socket configurations
Solution Approach 1:
The tall air impedance structure is segmented into multiple smaller units that can be stacked in varying quantities. This allows the overall height to be customized based on the specific thermal requirements and physical space constraints of different computing devices, rather than using a single fixed tall structure
3Adaptability or versatility
If snap-in tabs are added to enable stacking and adjustment, then adaptability to different thermal needs is improved, but the manufacturing complexity and assembly steps increase
Solution Approach 1:
The structure incorporates snap-in tabs as integral features of each segment. These tabs are designed to engage with corresponding recesses in adjacent segments, enabling straightforward stacking and adjustment. The modular design with standardized engagement features simplifies both manufacturing and assembly compared to creating fully custom adjustable structures
Data Source
AI summary
Examples described herein include air impeding structures with snap-in tabs. In some examples, an air impeding structure for a processing unit socket cover includes a main body encloses an interior space, a first snap-in tab, and a second snap-in tab. The main body may include a first curved wall at a first end of the main body connected to a second curved wall at a second end of the main body. The first snap-in tab extends below the first end of the main body and is recessed in relation to the first curved wall. The second snap-in tab extends below the second end of the main body and is recessed in relation to the second curved wall.