Stackable BGA Layer With Interposer Routing
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Solution Overview
Problem
Current methods for dense electronic packaging fail to efficiently stack commercially available ICs in a cost-effective and reliable manner, particularly in utilizing the high-speed and small outline benefits of BGA packages while allowing independent routing of non-common IO signals.
Innovation Solution
The solution involves using interposer boards with conductive traces to reroute leads vertically, allowing the stacking of pre-packaged ICs and enabling independent routing of signals between layers, while utilizing under-fill materials for structural stability and encapsulation for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional stacking methods are used for dense electronic packaging, then integration density is improved, but cost increases and reliability decreases due to complex interconnection requirements
Solution Approach 1:
The patent introduces an interposer board as an intermediary component between stacked BGA packages. This interposer provides a standardized interface with ball grid arrays that simplifies the interconnection process, allowing commercial off-the-shelf BGA packages to be stacked without complex custom interconnection solutions, thereby reducing manufacturing cost while maintaining high integration density
Solution Approach 2:
The patent segments the stacked package system into modular components: individual BGA packages, interposer boards with conductive traces, and encapsulation materials. This segmentation allows each component to be independently manufactured and tested, improving ease of manufacture and reducing overall system cost while achieving high integration density through vertical stacking
2Quantity of substance
If conventional stacking methods are used for dense electronic packaging, then integration density is improved, but reliability decreases due to signal routing complexities
Solution Approach 1:
The interposer board acts as a mediator that provides controlled impedance traces and proper signal termination, ensuring reliable signal transmission between stacked BGA packages. The interposer's conductive traces are designed to maintain signal integrity, thereby improving reliability while enabling high integration density through vertical stacking
Solution Approach 2:
The patent transitions from planar signal routing to three-dimensional vertical routing through the interposer board. This dimensional change allows signals to be routed vertically between layers with proper impedance control, improving signal routing reliability while achieving high integration density that would not be possible with conventional planar arrangements
3Volume of moving object
If BGA packages are stacked vertically, then space utilization is improved, but manufacturing complexity increases due to alignment and interconnection requirements
Solution Approach 1:
The interposer board serves as a manufacturing intermediary that provides alignment features and standardized ball grid arrays. These features simplify the stacking process by providing mechanical registration points and electrical interfaces that reduce alignment complexity, thereby enabling vertical stacking for improved space utilization without proportionally increasing manufacturing complexity
Solution Approach 2:
The interposer board is designed as a universal component that can interface with multiple different BGA packages. This universality simplifies manufacturing by allowing the same interposer design to work with various package types, reducing manufacturing complexity while enabling efficient vertical stacking for improved space utilization
4Ease of manufacture
If commercial off-the-shelf BGA packages are used, then cost is reduced, but adaptability decreases due to limited routing options for non-common IO signals
Solution Approach 1:
The interposer board provides additional vertical routing dimensions that enable independent routing of non-common IO signals between stacked BGA packages. This three-dimensional routing capability increases signal routing adaptability while maintaining cost effectiveness by using commercial off-the-shelf BGA packages
Solution Approach 2:
The interposer board segments the signal routing function, providing dedicated trace paths for different signal types. This segmentation allows independent routing of non-common IO signals while using standard BGA packages, thereby maintaining cost effectiveness while improving signal routing adaptability
Data Source
AI summary
Layers suitable for stacking in three dimensional, multi-layer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are under-filled and may be bonded together to form a stack of layers. The leads on the access plane are interconnected among layers to form a high-density electronic package.