Stackable Chip Package Structure With Heat Dissipation and Warpage Control
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Solution Overview
Problem
Existing chip packaging structures fail to simultaneously achieve effective heat dissipation, stacking of other package components, and prevention of warpage.
Innovation Solution
A package structure comprising a substrate with a chip, a heat dissipation structure surrounding the chip, an electrical connection structure on the substrate's surface and outer side of the heat dissipation structure, and a molding layer encapsulating both, where the electrical connection structure includes conductive bumps or pillars and an annular interposer, and thermal interface material layers are used to enhance heat dissipation and prevent warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a package structure is designed for lamination, then stacking capability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent combines heat dissipation function and lamination function into a single integrated package structure. The heat dissipation structure serves dual purposes: dissipating heat from the chip and providing a foundation for stacking additional package components, thereby resolving the contradiction between heat dissipation capability and stacking capability.
Solution Approach 2:
The package structure is designed with multi-functionality, where the heat dissipation structure also serves as a mounting platform for additional components. This universal design allows the same structure to perform both heat dissipation and lamination functions simultaneously, improving both heat dissipation capability and stacking capability.
2Temperature
If heat dissipation capability is improved, then temperature control is improved, but warpage occurs
Solution Approach 1:
The patent applies local quality by creating an uneven surface on the heat dissipation structure that contacts the molding layer. This localized surface modification improves heat dissipation contact while the overall structure maintains stability through the molding layer encapsulation, preventing warpage while preserving heat dissipation capability.
Solution Approach 2:
The package structure uses composite materials including the heat dissipation structure, molding layer, and thermal interface materials. This composite construction allows optimization of heat dissipation in specific regions while the combined structure provides overall stability and prevents warpage, resolving the contradiction between heat dissipation capability and structural stability.
3Adaptability or versatility
If a package structure integrates multiple functions, then versatility is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions (heat dissipation, lamination, and warpage prevention) into a single integrated package structure. By combining these functions rather than using separate components, the patent improves versatility while actually reducing overall device complexity compared to multiple separate components.
Solution Approach 2:
The heat dissipation structure is designed with universality to perform multiple functions: heat dissipation, providing a mounting platform for stacking components, and working with the molding layer to prevent warpage. This multi-functional design improves versatility while avoiding the complexity of multiple separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The package structure effectively dissipates heat, allows for the stacking of other components through electrical connections, and prevents warpage by using a molding layer to fasten the heat dissipation and electrical connection structures, thereby integrating heat dissipation, lamination, and warpage prevention functions.
Implementation Method 1
a heat dissipation structure arranged on the surface of the substrate and surrounding the chip
Implementation Method 2
a molding layer encapsulates the electrical connection structure and the heat dissipation structure
Implementation Method 3
thermal interface material layers are provided between the heat dissipation structure and the substrate and between the heat dissipation structure and the chip
Data Source
AI summary
The present disclosure provides a package structure and a related manufacturing method thereof, wherein a heat dissipation structure surrounding a chip is arranged, and an electrical connection structure is arranged on the outer side of the heat dissipation structure, so that other laminated package components can be electrically connected through a second electrical connection surface of the electrical connection structure to achieve lamination; the heat dissipation structure, the molding layer and the electrical connection structure are fastened through molding the electrical connection structure and the heat dissipation structure by the molding layer, and the molding layer and the electrical connection structure are prevented from warpage by the heat dissipation structure; finally, the package structure has the functions of heat dissipation, lamination and warpage prevention.