Stackable Connection Pin With Internal Cavity For Automated Assembly
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Solution Overview
Problem
Current stack mounting technologies face challenges in achieving low resistance and high thermal conductivity connections between stacked designs and motherboards, while also being poorly adapted for automated assembly processes.
Innovation Solution
A connection pin design featuring an anchoring part, a contact part with a protruding interconnection member, and a flange part with internal cavities and grooves for solder dispensing, allowing for simultaneous soldering of multiple pins and modules, reducing manual soldering steps and enhancing thermal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pin/socket combinations or homogenous interconnection pins are used for stack mounting, then mechanical connection is achieved, but electrical resistance is high and thermal conductivity is poor
Solution Approach 1:
The connection pin is divided into distinct functional segments: an anchoring part with internal cavity for soldering, a flange part for mechanical support and alignment, and a contact part with interconnection member for electrical contact. This segmentation allows each part to be optimized for its specific function, achieving low resistance electrical connection while maintaining structural integrity
Solution Approach 2:
The internal cavity within the anchoring part is designed to receive and nest the interconnection member from another connection pin. This nesting arrangement creates direct electrical and thermal pathways between stacked modules while reducing overall resistance compared to external connection methods
2Extent of automation
If traditional assembly techniques like wave soldering or surface mounting are used, then connection pins can be anchored, but the process is not well-suited for automated assembly of stacked modules
Solution Approach 1:
The connection pins are pre-assembled with modules before stacking, with the interconnection members already positioned in the internal cavities. This preliminary assembly allows the stacking process itself to serve as the mounting operation, enabling automated assembly without requiring separate soldering steps for each connection pin in the stack
Solution Approach 2:
The invention combines multiple functions into the connection pin structure itself: mechanical anchoring, electrical connection, thermal conduction, and module alignment. This merging eliminates the need for separate connection devices and simplifies the assembly process, making it suitable for automated manufacturing
3Productivity
If multiple connection pins are soldered individually in stacked modules, then reliable electrical connection is achieved, but assembly time and production complexity increase
Solution Approach 1:
Multiple connection pins are combined into a single integrated structure where the internal cavity receives the interconnection member. This allows all connection pins in a stack to be assembled simultaneously in a single operation, dramatically improving productivity while maintaining reliable electrical connections through the direct interconnection pathway
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables optimal low resistance connections with enhanced thermal integrity and mechanical stability, facilitating automated assembly processes by allowing solder to flow through internal cavities and grooves, reducing the need for additional connection devices and improving assembly efficiency.
Implementation Method 1
the internal cavity has at least one inner opening, adjacent to the flange part, that said contact side is provided with at least one groove communicating with said inner opening, and that the at least one groove stretches from the inner opening to a corresponding groove opening in an external axial surface of the flange part, whereby solder may be dispensed through the outer opening and into the internal cavity and flow from the internal cavity through the at least one inner opening and into said at least one groove
Data Source
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AI summary
The invention relates to a connection pin 1 for mounting in a through-hole 42 provided in a component carrier 40 of an electronic assembly, the connection pin comprising an anchoring part 2 adapted for insertion into said through-hole 42, a contact part 3 adapted to extend outside said through-hole 42, and a flange part 4 adapted to abut against said component carrier and located between said anchoring part and said contact part. The connection pin 1 is provided with an internal cavity 5, which is provided with an outer opening 6 at a free end of the anchoring part 2. The contact part 3 is provided with a protruding elongated interconnection member 9 at a free end thereof, and the respective shapes of the interconnection member 9 and the internal cavity 5 are such that the interconnection member is adapted for insertion into a corresponding internal cavity of another similar connection pin. According to the invention is also defined a method for producing an electronic assembly with stackable modules comprising of component carriers with connection pins, and such an electronic assembly.