Stackable Half-Bridge Power Module With Dual-Sided Cooling
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Solution Overview
Problem
Existing power semiconductor modules suffer from suboptimal heat transfer and manufacturing inefficiencies, leading to increased thermal resistance and higher costs, with limited installation flexibility due to specific space requirements.
Innovation Solution
A power semiconductor module design featuring two flat power semiconductors in a half bridge circuit, with inverted orientations, thermally and electrically connected by upper and lower contact modules to dedicated heat sinks, utilizing a direct bonded copper structure with ceramic insulation and a casting compound for mechanical reinforcement, allowing for efficient cooling and scalable stacking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional cooling systems with heat sinks and insulating layers are used, then electrical insulation is achieved, but thermal resistance increases and cooling efficiency decreases
Solution Approach 1:
The patent removes the electrically insulating layer from the thermal path between the power semiconductor and heat sink. Electrical insulation is achieved through the direct bonded copper (DBC) substrate structure and contact module design rather than through insulating layers in the thermal path, thereby extracting the insulating function from the thermal conduction path.
Solution Approach 2:
The DBC substrate and contact modules serve multiple functions simultaneously: they provide electrical connection, electrical insulation (through the DBC structure), and thermal conduction. This multi-functionality eliminates the need for separate insulating layers in the thermal path while maintaining both electrical isolation and thermal efficiency.
2Manufacturing precision
If multi-step production methods are used for manufacturing, then manufacturing precision is achieved, but production complexity and costs increase
Solution Approach 1:
The patent combines multiple functions (electrical connection, electrical insulation, and thermal conduction) into integrated components - the DBC substrate and contact modules. This merging of functions reduces the number of separate manufacturing steps and assembly operations required, simplifying production while maintaining precision through the integrated design.
3Temperature
If power semiconductors are cooled from both sides, then cooling efficiency is improved, but device complexity and installation space requirements increase
Solution Approach 1:
The patent enables dual-sided cooling by inverting the orientation of power semiconductors in stacked modules, allowing heat dissipation in both vertical directions. The first module's top surface and second module's bottom surface both serve as cooling surfaces, effectively utilizing the vertical dimension for thermal management without significantly increasing horizontal footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves reduced thermal resistance, improved cooling efficiency, and cost-effective production, enabling flexible application in various installations by optimizing heat transfer and electrical insulation while maintaining mechanical stability.
Implementation Method 1
a lower contact module for thermally connecting the first side of the first power semiconductor and the second side of the second power semiconductor to a lower heat sink
Implementation Method 2
utilizing a direct bonded copper structure with ceramic insulation
Implementation Method 3
The heat-conducting path (thermal path) normally has electrically insulating layers that electrically insulate the cooling structure
Implementation Method 4
Active or passive cooling systems are usually used to discharge the heat from the power semiconductors to another medium through a heat sink
Data Source
AI summary
A module for an inverter having first and second flat power semiconductors in a half bridge circuit, each having a drain connection on a first side and a source connection on the other side. The first side of the first power semiconductor faces the same direction as the second side of the second power semiconductor. A lower contact module thermally connects the first side of the first semiconductor and second side of the second semiconductor to a lower heat sink and electrically connects the drain on the first semiconductor to a first DC input and the source on the second semiconductor to a second DC input. An upper contact module thermally connects the second side of the first semiconductor and first side of the second semiconductor to an upper heat sink and electrically connects the source on the first semiconductor and drain on the second semiconductor to an AC output.