Stackable IC Package Finger Lead Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current integrated circuit packages face challenges in achieving simplified manufacturing processing, smaller dimensions, lower costs, reduced package counts, increased functionality, and higher IO connectivity while maintaining reliability and flexibility, which are essential for competitive products in the global market.
Innovation Solution
The solution involves a package in package (PIP) system with finger leads having an outward exposed area and an inward exposed area separated by a lead cavity, where a chip is connected to the finger lead and encapsulated with a stack encapsulant, allowing for improved connectivity and testing capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional integrated circuit packages are used with complete encapsulation, then protection and sealing are improved, but testing capabilities and connectivity access are worsened
Solution Approach 1:
The finger lead structure implements local quality by creating distinct zones: the inward exposed area provides access for testing operations, while the outward exposed area provides access for connectivity operations. This localized differentiation allows the package to maintain complete encapsulation for protection while providing specific access points for testing and connectivity without compromising overall sealing.
2Adaptability or versatility
If multiple separate integrated circuit packages are used to achieve high IO connectivity, then connectivity capabilities are improved, but package count and system complexity are worsened
Solution Approach 1:
The invention merges multiple functions into a single integrated circuit package. The finger lead structure combines testing access, connectivity access, and electrical connection functions within one package, eliminating the need for multiple separate packages. This consolidation achieves high IO connectivity while reducing package count and system complexity.
Solution Approach 2:
The finger lead structure provides multi-functionality by serving multiple purposes: it provides electrical connection between chips, provides access for testing operations through the inward exposed area, and provides access for connectivity operations through the outward exposed area. This universal structure replaces what would traditionally require multiple separate components.
3Ease of manufacture
If manufacturing processes are simplified to reduce costs, then production efficiency is improved, but manufacturing precision and quality control are worsened
Solution Approach 1:
The finger lead structure is pre-formed with distinct inward and outward exposed areas before final package assembly. This preliminary configuration of access areas allows for easier subsequent testing and connectivity operations without requiring complex post-assembly processes, thereby maintaining manufacturing precision while simplifying overall manufacturing.
Data Source
AI summary
An integrated circuit package system includes: providing a finger lead having a side with an outward exposed area and an inward exposed area separated by a lead cavity; positioning a chip adjacent the finger lead and connected to the finger lead; and a stack encapsulant encapsulating the chip and the finger lead with the outward exposed area and the inward exposed area of the finger lead substantially exposed.