Stackable IC Package with Protruding Support for Rigidity
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Solution Overview
Problem
Current integrated circuit package technologies face challenges in achieving simplified manufacturing processing, smaller dimensions, lower costs, reduced package counts, increased functionality, and higher connectivity while maintaining reliability and flexibility.
Innovation Solution
The method involves forming a stack module with a stack die encapsulated in an insulating material having protruding supports and pads, mounting this module on a package base, connecting the pads to the base, and encapsulating the entire structure with a package encapsulant, which allows for stackable and connectable integrated circuit packages with improved structural rigidity and reduced costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional integrated circuit packaging methods are used, then manufacturing processing is simplified, but package dimensions are larger and connectivity is lower
Solution Approach 1:
The patent implements a stacked package structure where multiple dies are vertically stacked and nested within a single package footprint. Each die is encapsulated individually but integrated into a unified package structure, enabling three-dimensional integration that reduces overall package area while maintaining functional complexity
Solution Approach 2:
The invention transitions from traditional two-dimensional planar packaging to three-dimensional vertical stacking. By utilizing the vertical dimension for die stacking and implementing wireless interconnects between stacked dies, the package achieves higher connectivity and functionality within a smaller footprint
2Adaptability or versatility
If multiple separate integrated circuit packages are used, then functionality is increased, but package count and system complexity increase
Solution Approach 1:
The patent combines multiple separate integrated circuit packages into a single unified stacked package structure. Multiple dies that would traditionally require separate packages are now integrated vertically within one package, reducing the total package count while maintaining or enhancing overall functionality through inter-die connectivity
Solution Approach 2:
The stacked package structure serves multiple functions within a single integrated unit: it provides individual die encapsulation, vertical interconnect pathways, shared package substrate, and unified external connections. This multi-functional integration allows the single package to replace what would traditionally require multiple separate packages
3Strength
If package spacers are used for structural support, then structural rigidity is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention eliminates package spacers from the structure entirely. Instead of adding spacer components for structural support, the design achieves rigidity through the stacked die architecture itself, where the dies and their interconnect structures provide inherent mechanical support, thereby simplifying manufacturing and reducing component count
4Reliability
If traditional packaging methods are used, then manufacturing is simpler, but yield and reliability are lower due to lack of early testing
Solution Approach 1:
The patent enables early testing of dies during the packaging process itself, before final assembly is complete. By incorporating test access points and intermediate testing stages within the stacked package structure, defects can be identified and isolated early, improving yield by preventing defective units from proceeding through full manufacturing
Data Source
AI summary
A method for manufacturing an integrated circuit package system includes: forming a stack module including: providing a stack die and encapsulating the stack die with an insulating material having a protruding support and a pad connected to the stack die; mounting the stack module on a package base; connecting the pad to the package base; mounting a top die on the protruding support; connecting the top die to the package base; and encapsulating the top die, the package base, and the stack module with a package encapsulant.