Stackable IC Package with Interposer and Bump Stack
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Solution Overview
Problem
Current integrated circuit package solutions fail to provide simplified manufacturing processing, smaller dimensions, lower costs, increased functionality, and higher IO connectivity while maintaining reliability and flexibility, which are critical for high-performance electronic products.
Innovation Solution
The integration of an interposer chip with active circuitry and a conductive bump stack having a base and stud bump end, connected to a package substrate and encapsulated with a package encapsulant, allowing for enhanced connectivity and reduced component height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple separate integrated circuit packages are used to provide high connectivity and complex functions, then functionality and IO connectivity are improved, but device complexity and package footprint increase
Solution Approach 1:
The patent combines multiple separate integrated circuit packages into a single unified package structure. Multiple chips are mounted on a common package substrate with shared encapsulation, reducing the number of discrete packages while maintaining high connectivity through integrated interconnection structures that provide electrical coupling between chips.
Solution Approach 2:
The package substrate serves multiple functions simultaneously: it provides mechanical support for multiple chips, establishes electrical interconnections between chips, provides external connection interfaces, and offers structural integration for the entire multi-chip assembly, thereby reducing the need for separate components.
2Adaptability or versatility
If multiple separate integrated circuit packages are used to provide high connectivity, then IO connectivity is improved, but manufacturing complexity and costs increase
Solution Approach 1:
The patent combines multiple separate integrated circuit packages into a single unified package structure. Multiple chips are mounted on a common package substrate with shared encapsulation, reducing the number of discrete packages while maintaining high connectivity through integrated interconnection structures that provide electrical coupling between chips.
3Adaptability or versatility
If package components are made replaceable for flexibility and upgrades, then adaptability is improved, but manufacturing precision and assembly complexity increase
Solution Approach 1:
The patent segments the package into modular components including individually mountable chips, a common package substrate, and replaceable encapsulation sections. This segmentation allows specific components to be replaced or upgraded independently while maintaining precise electrical connections through standardized interconnection interfaces.
Solution Approach 2:
The package structure incorporates dynamic replaceability where chips and encapsulation sections can be removed and replaced after initial assembly. This enables post-manufacturing modifications, upgrades, and repairs while maintaining the structural integrity and electrical connectivity of the overall package system.
Data Source
AI summary
An integrated circuit package system includes: providing a package substrate; mounting an interposer chip containing active circuitry over the package substrate; attaching a conductive bump stack having a base bump end and a stud bump end, the base bump end on the interposer chip; connecting a stack connector to the interposer chip and the package substrate; and applying a package encapsulant over the interposer chip, the stack connector, and the conductive bump stack with the stud bump end of the conductive bump stack substantially exposed.