Stackable Microelectronic Package Contact Arrangements
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Solution Overview
Problem
Conventional interconnecting methods for multiple microelectronic dies in memory package structures face complexity and performance issues due to the complexity of electrical connections and signal propagation delays, particularly for control and address signals.
Innovation Solution
A microelectronic assembly design featuring a substrate with specific contact arrangements, including concentric ring and L-shaped regions, allows for efficient interconnection of multiple microelectronic dies, reducing signal path lengths and propagation delays by centrally positioning contacts for control and address signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional interconnecting methods are used for multiple microelectronic dies, then the electrical connections can be established, but the complexity of interconnections and signal propagation delays increase
Solution Approach 1:
The contact array is segmented into multiple distinct patterns including concentric ring patterns and L-shaped region patterns. Each pattern type serves specific interconnection functions for different die configurations, allowing complex multi-die arrangements to be broken down into manageable connection groups that reduce overall interconnection complexity
Solution Approach 2:
The patent transitions from conventional two-dimensional planar contact arrangements to three-dimensional stacked die configurations with corresponding contact patterns on multiple substrate surfaces. This dimensional expansion allows vertical stacking of microelectronic dies while maintaining organized electrical interconnections through vertically-aligned contact patterns, reducing horizontal signal propagation distances
2Reliability
If conventional contact arrangements are used, then all microelectronic dies can be interconnected, but signal propagation delays increase due to longer signal paths
Solution Approach 1:
Different contact patterns are assigned to different spatial regions and functional requirements: concentric ring patterns are optimized for radial signal distribution to multiple dies, while L-shaped patterns are optimized for corner-to-corner die interconnections. This local optimization of contact geometries minimizes signal path lengths for specific connection types
Solution Approach 2:
The substrate with its organized contact patterns serves as an intermediary platform that mediates electrical connections between multiple stacked microelectronic dies. The contact patterns act as intermediate connection points that reduce direct die-to-die connection distances, thereby reducing signal propagation delays
3Productivity
If multiple ranks of microelectronic dies are stacked, then the integration density increases, but the complexity of contact arrangements increases
Solution Approach 1:
The contact patterns are designed with multi-functionality to serve various die stacking configurations. The concentric ring and L-shaped patterns can accommodate different numbers of dies per rank and different rank configurations, reducing the need for completely different contact designs for each integration scenario
Solution Approach 2:
Multiple contact patterns are nested on the substrate surface with concentric rings containing inner contacts and L-shaped regions positioned in specific quadrants. This nested arrangement allows efficient use of substrate area to support multiple die ranks while maintaining organized, non-overlapping contact zones that simplify interconnection routing
Data Source
AI summary
An apparatus relates generally to a microelectronic assembly. In this apparatus, a first substrate and a second substrate each have opposing surfaces. Contact arrangements are disposed on a surface of the first substrate, including: first contacts disposed as a ring to provide a first array of the contact arrangements on such surface; and second contacts disposed interior to the ring of the first contacts to provide a second array of the contact arrangements on the first surface. The first contacts and the second contacts are for interconnection with first microelectronic dies and second microelectronic dies. The second microelectronic dies are disposed below the first microelectronic dies in same a package as the first microelectronic dies. The first microelectronic dies and the second microelectronic dies include at least two ranks thereof for commonly sharing the first contacts and the second contacts among the first microelectronic dies and the second microelectronic dies.