Stackable Micropackages Using Flexible Redistribution Substrates
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Solution Overview
Problem
Existing methods for stacking integrated circuits often result in complex structures with scalability issues and high costs, particularly when increasing memory density, due to the use of encapsulated or bare die configurations.
Innovation Solution
The system involves stacking one or more integrated circuit die on flexible redistribution substrates, bonded and wire-bond connected, with frame members to create low-profile, high-density modules, using well-understood materials for known good die management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If encapsulated or bare die configurations are used for stacking integrated circuits, then memory density can be increased, but structure complexity and manufacturing cost increase
Solution Approach 1:
The patent divides the stacked module into discrete stackable assemblies, where each assembly contains a redistribution substrate with integrated circuit die mounted on it. These assemblies are further segmented into individual units that can be independently manufactured and then stacked together using frame members, simplifying the overall structure while achieving high memory density.
Solution Approach 2:
The patent transitions from planar arrangement of integrated circuits to a three-dimensional stacked configuration. By mounting die on both sides of flexible redistribution substrates and stacking multiple assemblies vertically using frame members, the system achieves higher memory density without proportionally increasing footprint area.
2Quantity of substance
If encapsulated or bare die configurations are used for stacking integrated circuits, then memory density can be increased, but manufacturing cost increases
Solution Approach 1:
The patent divides the stacked module into discrete stackable assemblies, where each assembly contains a redistribution substrate with integrated circuit die mounted on it. These assemblies are further segmented into individual units that can be independently manufactured and then stacked together using frame members, simplifying the overall structure while achieving high memory density.
Solution Approach 2:
The patent employs flexible redistribution substrates that can be bent and conform to different configurations during assembly. This flexibility allows for simplified manufacturing processes and reduces the need for complex alignment and bonding equipment, thereby lowering manufacturing costs while enabling high-density stacking.
3Reliability
If complex structures are used for stacking bare die, then die management can be achieved, but scalability becomes difficult
Solution Approach 1:
The patent divides the stacked module into discrete stackable assemblies, where each assembly contains a redistribution substrate with integrated circuit die mounted on it. These assemblies are further segmented into individual units that can be independently manufactured and then stacked together using frame members, simplifying the overall structure while achieving high memory density.
Solution Approach 2:
The patent creates universal stackable assemblies that can accommodate different types of integrated circuit die through the flexible redistribution substrate design. The frame members and substrate structure are designed to be configuration-agnostic, allowing the same basic assembly design to be scaled and adapted for various memory densities and die types without redesigning the entire system.
Data Source
AI summary
The present invention provides a system and method for devising stackable assemblies that may be then stacked to create a stacked circuit module. One or more integrated circuit (IC) die are disposed on one or more sides of a redistribution substrate that is preferably flexible circuitry. In some preferred embodiments, the die and redistribution substrate are bonded together and wire-bond connected. Two or more stackable assemblies are interconnected through frame members to create low profile high density stacked circuit modules.