Stackable Modular Electronics With Interlocking Cooling Paths

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Solution Overview

Problem

Existing electronic device systems face challenges in efficient cooling, modular expansion, and seamless integration, particularly in harsh environments, with limitations in heat dissipation and flexible interconnectivity.

Innovation Solution

A modular electronic device system using hexagonal or rectangular interlocking modules with integrated cooling pathways and mechanical interlocking features, enabling efficient heat transfer and daisy-chaining connections for versatile expansion and integration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional electronic device systems are used, then integration and expansion are limited, but modular stackable systems increase device complexity and interconnection requirements

Engineering Contradiction:

Improvemodular expansion capabilityVSAvoidinterconnection complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The electronic device system is divided into multiple independent modular units, each capable of functioning autonomously while being stackable with other modules. This segmentation enables flexible expansion without requiring complete system redesign, as modules can be added, removed, or reconfigured independently.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The modular design employs universal interconnection interfaces and standardized mounting mechanisms that allow the same module to be used in multiple configurations and positions. This universality reduces the variety of interconnection types needed, thereby reducing overall system complexity despite increased modularity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If conventional cooling methods are used, then heat dissipation is insufficient for high-power devices, but integrated cooling pathways increase manufacturing complexity

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The cooling pathways are merged with the structural body of the modular units, integrating thermal management functionality directly into the mechanical framework. This combination eliminates the need for separate cooling system installation and reduces the number of discrete components, thereby simplifying manufacturing despite the enhanced cooling capability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The cooling system utilizes the vertical stacking dimension to create heat dissipation pathways, transforming the traditional horizontal cooling approach into a three-dimensional thermal management architecture. This dimensional transition allows efficient heat removal through the stack structure itself without adding lateral complexity to the manufacturing process.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Ease of operation

If modules are loosely connected, then assembly is easier, but lateral displacement and misalignment occur reducing reliability

Engineering Contradiction:

Improveassembly easeVSAvoidconnection stability

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The mechanical interlocking features employ asymmetric geometries with导向 surfaces and tapered entry zones that guide modules into correct alignment during assembly. The asymmetric design provides natural alignment cues that reduce assembly difficulty while simultaneously ensuring precise positioning and preventing lateral displacement once connected.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The module interfaces incorporate pre-formed alignment features and self-centering mechanisms that automatically position modules correctly during the stacking process. This preliminary alignment action occurs before final engagement, ensuring reliable connection without requiring complex external alignment tools or procedures.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system provides efficient cooling, flexible expansion, and seamless integration, with improved heat dissipation and reduced latency, suitable for rugged and commercial applications.

Implementation Method 1

The mechanical interlocking features between the modules also provides a cooling conduction cooling pathway for the efficient cooling and heat transfer of the overall distributed system

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12575040B2Stackable modular electronic device system and associated devices

Publication Date: 2026.03.10 SHARFI BENJAMIN K

AI summary

A modular electronic device is formed from a plurality of stackable hexagonal or rectangular-shaped modules. Each module is locked to another adjacent unit with an indented groove inserted through their sidewalls. Each hexagonal or rectangular module can be made of one or four extrusion elements which then can be stacked in a honeycomb or brick wall configuration.