Stackable Semiconductor Package with Exposed Conductive Pads

The package formation process is segmented into distinct modular steps: providing a substrate with conductive pads, attaching a semiconductor device, forming an encapsulant with a recess, and exposing conductive pads. This segmentation creates a standardized, repeatable process that reduces manufacturing complexity while enabling multiple devices to be stacked vertically on a small PCB footprint.

The invention transitions from planar integration to three-dimensional stacking by forming an encapsulant with a recess that exposes conductive pads on the substrate. This vertical stacking approach allows multiple semiconductor devices to be integrated in the Z-dimension rather than spreading them out in the X-Y plane, conserving PCB space while maintaining standardized manufacturing processes.

The encapsulant is formed with a localized recess that selectively exposes only the conductive pads on the substrate surface, while the rest of the substrate and semiconductor device remain encapsulated. This local modification approach provides the versatility needed for different IC technologies and procurement sources without requiring complex overall encapsulation processes, as only specific areas need to be exposed.

The conductive pads are extracted from the encapsulated substrate by forming a recess in the encapsulant material. This extraction allows external semiconductor devices to be attached to the exposed conductive pads while the majority of the package remains protected by the encapsulant, balancing versatility with manufacturing simplicity.