Stackable PCB Modules for Compact Hardware Prototyping
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing hardware prototyping solutions, such as Arduino and Raspberry Pi boards, are too large and cumbersome for real-world deployment, require duplicated efforts, and fail to accurately represent end-product power consumption and performance metrics.
Innovation Solution
A modular ecosystem of stackable printed circuit boards (Petal) with defined interconnects, allowing developers to snap together boards with specific functions, ensuring compact form factor and accurate representation of end-product conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If generic hardware prototyping boards (Arduino, Raspberry Pi) are used, then a wide range of applications can be supported, but the board size becomes too large and power consumption becomes inaccurate for real product deployment
Solution Approach 1:
The prototyping system is divided into modular functional blocks (processor module, sensor module, actuator module, power module, communication module) that can be independently selected and stacked. Each module contains only the specific components needed for its function, eliminating extraneous peripherals and reducing overall board size while maintaining application versatility through modular combination.
Solution Approach 2:
Multiple functional modules are stacked vertically in a layered configuration, with each module containing its own integrated circuitry and components. The modules nest together through standardized interconnect interfaces, creating a compact three-dimensional assembly that reduces the horizontal footprint while maintaining all necessary functionality.
2Adaptability or versatility
If generic hardware prototyping boards are used, then various applications can be supported, but duplicated R&D investment and time are required for both feasibility and prototyping phases
Solution Approach 1:
The system provides pre-fabricated, pre-tested functional modules with standardized interfaces and integrated circuits already populated. These modules are prepared in advance with common components (processors, sensors, communication interfaces) that can be directly reused across multiple applications, eliminating the need to redesign and re-populate circuits for each new project and significantly reducing R&D cycle time.
Solution Approach 2:
The modular modules are designed with universal interfaces and standardized connection protocols that work across different application domains. A single module (e.g., a processor module or communication module) can be used in multiple different end applications by simply changing the combination of modules, eliminating duplicated R&D efforts while maintaining broad application support.
3Ease of operation
If Arduino board with fly-wiring is used for field trial, then feasibility can be tested, but the setup is bulky and difficult to attach to vehicle tire
Solution Approach 1:
The functional modules are stacked vertically in a compact tower configuration, reducing the horizontal footprint from a spread-out fly-wired arrangement to a compact vertical assembly. This nested stacking dramatically improves the form factor for attachment to constrained surfaces like vehicle tires while maintaining all necessary electrical connections through the standardized inter-module interfaces.
4Adaptability or versatility
If Arduino board with extraneous peripherals is used, then a single product can cater to wide range of applications, but accurate representation of end application operating conditions (battery power consumption) cannot be achieved
Solution Approach 1:
Each modular functional block contains only the specific components and circuitry needed for its designated function, with no extraneous peripherals. The power consumption characteristics of each module reflect only its intended function, enabling accurate measurement and optimization of power usage for specific applications. The modular architecture allows selection of only the necessary functions, eliminating unnecessary power consumption from unused peripherals.
Data Source
AI summary
Disclosed herein is a system and method for rapid hardware application development and deployment using modular/stackable electronic circuit boards or printed circuit boards (PCBs). The stackable PCBs can be snapped (or stacked) together to create a larger integrated electronic circuit. The stackable PCBs consist of a PCB, RF transceivers, conductive contact pads, matching circuits and a region to receive the conductive shapes of the PCB and non-RF connectors.