Stackable Photonic Interconnect Module for High Bandwidth Density
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Solution Overview
Problem
Conventional photonic technologies, such as VCSELs, struggle to meet the high bandwidth, size, and power requirements for direct I/O interconnects, limiting their scalability and reliability for future chip communication, while silicon photonics offer potential but require advancements in packaging and assembly techniques.
Innovation Solution
An interconnect module integrating an electrical connector, optical fiber, and a bridge chip with silicon-on-insulator technology, capable of converting electrical to optical and vice versa, facilitating scalable and reliable direct I/O interconnects through a stacked configuration with a backplane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If VCSELs are used for photonic communication, then ease of manufacture and cost-effectiveness are improved, but bandwidth and scalability are limited
Solution Approach 1:
The patent replaces conventional VCSEL-based photonic systems with silicon photonics technology, substituting one physical implementation approach with another that offers superior bandwidth scalability while maintaining manufacturing feasibility through standard semiconductor fabrication processes
Solution Approach 2:
The invention transitions from VCSEL parameters (modest aggregate data capacity) to silicon photonics parameters (extreme bandwidth requirements), changing the fundamental operating parameters of the photonic system to achieve higher bandwidth while retaining ease of manufacture through integrated circuit fabrication
2Productivity
If silicon photonics are used for direct I/O interconnects, then bandwidth and scalability are improved, but packaging and assembly complexity increases
Solution Approach 1:
The patent merges the silicon photonic integrated circuit with standard electrical connector assemblies and optical fiber interconnects, combining previously separate subsystems into an integrated module that reduces packaging complexity while maintaining extreme bandwidth capability
Solution Approach 2:
The invention creates a universal interconnect module that integrates multiple functions (electrical signaling, optical conversion, fiber coupling) into a single standardized assembly that can be deployed across different systems, reducing assembly complexity through standardized interfaces and procedures
3Productivity
If pin count of electrical I/O interconnects is increased to meet bandwidth requirements, then bandwidth is improved, but physical limitations are reached
Solution Approach 1:
The patent substitutes electrical pin-based interconnects with optical fiber-based interconnects, replacing the mechanical/electrical signaling mechanism with optical signaling that achieves extreme bandwidth without increasing pin count, as optical fibers can carry vastly more data through wavelength division multiplexing and higher signal rates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-bandwidth, low-latency, and low-energy communication, achieving up to 100 Gbps/mm linear I/O bandwidth density, addressing the limitations of traditional electrical interconnects and facilitating the integration of silicon photonics into viable electrical-connector-based systems.
Implementation Method 1
a bridge chip, having a first surface and coupled to the electrical connector and the optical fiber, which converts the electrical signals into the optical signals and the optical signals into the electrical signals
Data Source
AI summary
An interconnect module for communicating electrical signals and optical signals is described. In particular, an integrated circuit in the interconnect module receives and transmits the electrical signals with other components in a system that includes the interconnect module via an electrical connector. In addition, the integrated circuit receives and transmits electrical signals to a hybrid silicon-photonic bridge chip that performs electrical-to-optical and optical-to-electrical conversion. In turn, this bridge chip receives and transmits optical signals via an optical fiber. The interconnect module can be remateably connected to a backplane in the system, and can be arranged in a stacked configuration with other instances of the interconnect module. In these ways, the interconnect module facilitates dense, modular or scalable, and compact electrical and optical communication in the system.