Stackable Plasma Source Array for Wafer Edge Uniformity Control
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Solution Overview
Problem
Current plasma processing systems face challenges in achieving high uniformity across semiconductor wafers, particularly near the edges, due to limitations in traditional hardware architectures and control methods, which require new approaches to manage multiple factors influencing plasma distribution and chamber design.
Innovation Solution
A stackable plasma source system with a 2D array of small identical plasma sources, each independently controlled, uses digital process control to activate or deactivate individual plasma generation cells, allowing for precise control of plasma exposure time to achieve uniformity, and includes a support structure and electrical connectors for external activation, enabling flexible configuration and testing of plasma cells.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional plasma processing systems use conventional hardware architectures and control methods, then the system structure is simple, but the process uniformity across the wafer deteriorates, especially near the edges
Solution Approach 1:
The plasma source is divided into multiple independently controllable plasma generation cells arranged in a 2D array. Each cell can be individually activated or deactivated to precisely control plasma flux distribution across different regions of the wafer, enabling edge-to-edge uniformity control that traditional single-source systems cannot achieve.
Solution Approach 2:
The system implements dynamic control of plasma generation cells through digital process control, allowing real-time adjustment of which cells are active and their individual plasma output levels. This dynamic reconfiguration capability enables adaptation to different process requirements and continuous optimization of uniformity across the wafer surface.
2Measurement precision
If plasma generation cells are made selectively removable and individually controllable, then the control precision over plasma flux is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The plasma source array consists of multiple identical or near-identical plasma generation cells that can be manufactured using standardized processes. Each cell is a discrete, removable module that interfaces with the support structure through standardized mechanical and electrical connections, simplifying manufacturing and assembly compared to a monolithic system.
Solution Approach 2:
The plasma generation cells are designed as universal modules that can be individually tested, calibrated, and replaced. The standardized interface design allows the same cell to be used in different positions within the array, and defective cells can be swapped out without affecting the entire system, improving ease of manufacture and maintenance.
3Adaptability or versatility
If a 2D array of plasma sources is used with individual control, then the adaptability for different process requirements is improved, but the system complexity increases
Solution Approach 1:
The digital process control system enables dynamic reconfiguration of the plasma source array by selectively activating or deactivating individual cells based on process requirements. This dynamic control allows the system to adapt to different wafer sizes, process types, and uniformity requirements without physical reconfiguration, managing complexity through software control rather than hardware changes.
Solution Approach 2:
The system transitions from traditional single-point or linear plasma source control to a two-dimensional array of independently controllable cells. This dimensional expansion provides additional degrees of freedom for controlling plasma flux distribution, enabling sophisticated patterns and profiles to be created across the wafer surface through digital addressing of individual cells.
4Ease of operation
If electrical connectors extend outside the processing chamber for external activation, then the ease of operation and control is improved, but the device complexity increases
Solution Approach 1:
The electrical connectors serve as intermediaries that extend from the plasma generation cells outside the processing chamber to external control systems. This intermediary connection allows plasma cells to be activated and controlled from outside the vacuum environment, simplifying operation by eliminating the need for internal chamber controls while the standardized connector design manages the added complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances process uniformity by allowing for precise control of plasma flux distribution, improving edge-to-edge consistency and reducing manufacturing costs by enabling individual testing and simpler manufacturing of plasma cells, thus meeting stringent semiconductor manufacturing requirements.
Implementation Method 1
The plasma generating structure supplies plasma related fluxes to a region of the processing chamber responsive to being activated
Data Source
AI summary
A system, method, and apparatus for processing substrates. A plasma generation assembly includes a support structure configured to be disposed within a processing chamber, the support structure forming a set of ducts. The plasma generation assembly further includes a plasma generation cell selectively removable from and selectively replaceable within one of set of ducts. The plasma generation cell includes a dielectric barrier discharge (DBD) structure. The DBD structure includes a set of electrodes disposed along a first dielectric surface and covered by a second dielectric layer. The DBD structure is configured to initiate plasma discharge within the processing chamber. The DBD structure further includes electrical terminals coupled the DBD structure with an electric driving network.