Stackable Plasma Source with Cell-Level Control for Wafer Uniformity
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Solution Overview
Problem
Current plasma processing systems face challenges in achieving high uniformity across wafers, particularly near the edges, due to interference from various factors such as plasma uniformity, chamber design, and wafer temperature distribution, which requires new methods beyond traditional hardware architectures and control systems.
Innovation Solution
A stackable plasma source system with a 2D array of small identical plasma sources, each independently activated or deactivated, using digital process control to manage exposure time and plasma generation, allowing for precise control of plasma flux across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional hardware architectures and control systems are used for plasma processing, then the system structure is simple, but the process uniformity across the wafer cannot be improved
Solution Approach 1:
The plasma source is divided into multiple independently controllable plasma generation cells arranged in a 2D array. Each cell can be individually activated or deactivated, allowing precise spatial control of plasma flux distribution across the wafer surface. This segmentation enables independent optimization of different regions to achieve high process uniformity.
Solution Approach 2:
The system implements dynamic control of plasma generation by selectively activating or deactivating individual plasma cells based on real-time process requirements. This dynamic capability allows the system to adapt plasma distribution patterns during processing, enabling precise control over process uniformity that static traditional systems cannot achieve.
2Manufacturing precision
If a 2D array of plasma generation cells is used, then process uniformity is enhanced, but the device complexity increases
Solution Approach 1:
All plasma generation cells in the 2D array are designed with identical structures and functionalities. Each cell can serve as an independent plasma source, and by controlling different combinations of these identical cells, the system can achieve multiple plasma distribution patterns for different process requirements, reducing design complexity while maintaining precision.
Solution Approach 2:
The system uses multiple copies of the same standardized plasma generation cell design arranged in a 2D array. This modular copying approach simplifies manufacturing and control, as each cell is identical and can be independently addressed, reducing the complexity that would arise from designing and controlling unique structures for each position.
3Manufacturing precision
If individual control of plasma generation cells is implemented, then process precision is improved, but the manufacturing cost increases
Solution Approach 1:
The plasma source is segmented into standardized modular cells that can be independently controlled. This segmentation enables precise plasma flux control at each position while using identical modular units, which simplifies manufacturing processes and reduces costs compared to building custom-controlled systems.
Solution Approach 2:
The system achieves precise plasma flux control by changing the operational parameters (activation state) of individual plasma cells rather than requiring complex hardware modifications for each cell. This parameter-based control approach maintains manufacturing simplicity while enabling high precision plasma distribution control.
4Manufacturing precision
If digital process control is used to manage exposure time, then plasma flux control is improved, but the control system complexity increases
Solution Approach 1:
The system replaces complex mechanical control mechanisms with digital electronic control. By using digital signals to selectively activate or deactivate plasma cells and control their exposure times, the system achieves high precision plasma flux management while simplifying the physical control architecture compared to traditional mechanical systems.
Solution Approach 2:
The digital control system manages plasma exposure by controlling the temporal activation patterns of individual plasma cells. Through periodic or pulsed activation sequences, the system precisely controls plasma flux exposure time and distribution, achieving high manufacturing precision through software-based temporal control rather than complex hardware mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances process uniformity by enabling individual control of hundreds of plasma generation cells, improving edge-to-edge consistency and reducing manufacturing costs through independent testing and simpler panel manufacturing.
Implementation Method 1
The plasma generating structure supplies plasma related fluxes to a region of the processing chamber responsive to being activated
Data Source
AI summary
A system, method, and apparatus for processing substrates. A plasma processing system includes a processing chamber and a support structure disposed within the processing chamber. The support structure forms a set of ducts. The plasma processing system further includes a plurality of plasma generation cells disposed within corresponding ducts of the set of ducts. The plasma generation cells are configured to be selectively activated or deactivated. The plasma generating structure supplies plasma related fluxes to a region of the processing chamber responsive to being activated. The plasma processing system further includes a network of electrical connectors coupled to each of the plurality of plasma generation cells. The network of electrical connectors are configured to supply electrical signals that selectively activate or deactivate individual plasma generation cells.