Stackable Power Module Thermal Management
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Solution Overview
Problem
Conventional power modules using multiple power semiconductor devices in parallel for heat management require significant space and reduce power density due to the need for large printed circuit boards, leading to inefficient heat dissipation and potential device failure from excessive temperature.
Innovation Solution
A stackable power module design featuring a module body with top and bottom contact pads and conductive structures that connect power semiconductor devices, providing a thermal capacity to manage heat generated during switching cycles without exceeding critical temperature thresholds, allowing for efficient heat dissipation and reduced component count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple power semiconductor devices are connected in parallel to share load requirements, then heat generation per device is reduced, but space requirements increase and power density decreases
Solution Approach 1:
The patent transitions from a planar arrangement of multiple power semiconductor devices on a printed circuit board to a three-dimensional stacked configuration. Multiple power modules are vertically stacked and interconnected through conductive structures, utilizing the vertical dimension to achieve high power density without increasing footprint area. This dimensional change allows numerous devices to be packed into a compact volume while maintaining effective heat dissipation paths.
2Temperature
If multiple power semiconductor devices are connected in parallel, then heat management is improved, but device count and assembly complexity increase
Solution Approach 1:
The patent merges multiple power semiconductor devices into integrated power modules, where each module contains multiple devices already interconnected and thermally managed as a unit. These modules are then stacked and connected through conductive structures, reducing the total number of discrete components and simplifying assembly while maintaining the heat management benefits of parallel device operation.
Solution Approach 2:
The patent implements a nested structure where multiple power modules are stacked one inside another, with each module containing multiple power semiconductor devices. This nested arrangement allows compact integration of numerous devices while providing hierarchical thermal management paths, reducing both device count visibility and assembly complexity.
3Temperature
If conventional power modules use large printed circuit boards for parallel device connections, then heat dissipation capacity increases, but power density decreases
Solution Approach 1:
The patent replaces the extensive planar heat dissipation paths on large printed circuit boards with vertical three-dimensional heat conduction paths through stacked modules and conductive structures. This dimensional transition maintains total heat dissipation capacity while dramatically reducing the horizontal footprint, thereby increasing power density.
Solution Approach 2:
The patent employs conductive structures with high thermal conductivity materials to connect stacked power modules, creating composite thermal management pathways. These conductive structures serve dual functions as both electrical interconnects and thermal conduction paths, enabling efficient heat dissipation in a compact volume without requiring large printed circuit board areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stackable power module configuration enhances space utilization, reduces the number of required semiconductor devices, and improves heat management by buffering thermal energy effectively, maintaining temperature within safe limits during switching cycles.
Implementation Method 1
the at least one conductive structure has a thermal capacity sufficient to take up an amount of heat generated during a switching cycle of the at least one power semiconductor device without increasing temperature above a critical threshold
Data Source
AI summary
The present invention relates to a stackable power module, comprising a module body having a top side and a bottom side provided with top and bottom contact pads, each of the top contact pads electrically connected to a corresponding bottom contact pad; at least one power semiconductor device embedded in the module body, at least one conductive structure connecting the power semiconductor device to a respective top and/or bottom contact pad, wherein the at least one conductive structure has a thermal capacity sufficient to take up an amount of heat generated during a switching cycle of the at least one power semiconductor device without increasing temperature above a critical threshold.