Stackable Power Package Layout for Two-Sided Heat Dissipation
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Solution Overview
Problem
Existing packaged electronic power devices face challenges in efficiently dissipating heat, particularly in simpler circuits or when high power is required, due to complex configurations and limited heat dissipation capabilities.
Innovation Solution
A stackable, packaged electronic power device with a leadframe including a die-attach support, first and second leads, and a package of insulating material. The leads have outer portions extending outside the package, with lead heights greater than the package height, allowing for enhanced heat dissipation and flexibility in circuit arrangements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a standard package with leads arranged on the same side of the dissipation structure is used, then the device complexity is reduced, but the heat dissipation capability is limited to downward direction only
Solution Approach 1:
The patent transitions from a single-sided lead arrangement (2D plane) to a multi-directional lead configuration extending in three dimensions. Leads are arranged to extend from multiple sides of the package, enabling heat dissipation in both upward and downward directions simultaneously, thus adding a vertical dimension to the thermal management architecture.
Solution Approach 2:
The dissipation structure is segmented into multiple functional zones with leads distributed across different sides of the package. This segmentation allows independent thermal pathways in different directions, enabling simultaneous upward and downward heat dissipation through separate lead groups positioned on opposite sides of the package.
2Adaptability or versatility
If leads are arranged on the same side of the dissipation structure, then the manufacturing process is simplified, but the adaptability for different circuit configurations is reduced
Solution Approach 1:
The package design provides universal adaptability for various circuit configurations by incorporating leads that can be arranged in multiple spatial configurations. The same basic package structure can support different lead arrangements (e.g., opposite sides, adjacent sides, or mixed configurations) to accommodate different circuit topologies and mounting requirements without requiring entirely different package designs.
Solution Approach 2:
The lead arrangement is made dynamic and configurable rather than fixed. The package structure allows for flexible lead positioning and configuration adaptation during manufacturing and assembly, enabling the same package type to be customized for different circuit applications through variable lead routing and positioning strategies.
3Area of stationary object
If a DBC multilayer leadframe with side-by-side dice arrangement is used, then the circuit topology flexibility is improved, but the area occupied increases significantly
Solution Approach 1:
The patent transitions from a planar side-by-side dice arrangement (2D layout) to a multi-level stacked configuration with leads extending in the vertical dimension. By arranging dice and leads in three-dimensional space rather than purely lateral positions, the design achieves equivalent circuit topology flexibility while dramatically reducing the footprint area occupied by the package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective heat dissipation both upwards and downwards, allowing for stable operation in high-power applications and simpler circuits, while also facilitating easy stacking and connection of power devices for increased electrical performance.
Implementation Method 1
A package of insulating material is included that has a parallelepipedal shape... The package surrounds the die and at least partially surrounds the die-attach support
Data Source
AI summary
A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.