Stackable Power Package Leadframe for Upward Heat Dissipation
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Solution Overview
Problem
Existing packaged electronic power devices face challenges in heat dissipation, particularly when dealing with high-power applications, as they often require complex configurations and may not efficiently dissipate heat upwards, which can be a limitation in simpler circuits or when high power is involved.
Innovation Solution
A packaged electronic power device with a leadframe configuration that includes a die-attach support and leads, where the leads extend beyond the package height, allowing for both upward and downward heat dissipation, and enabling the device to be stacked with heat sinkers arranged between each power device for enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If leads are arranged on the same side of the dissipation structure, then the device can dissipate heat downwards, but the device cannot efficiently dissipate heat upwards
Solution Approach 1:
The patent extends leads in the vertical dimension (upward direction) in addition to the conventional horizontal arrangement. The leads have outer portions extending outside the package from lateral surfaces and also have portions projecting from the first base, creating a three-dimensional lead configuration that enables both downward and upward heat dissipation paths.
2Temperature
If a complex leadframe configuration is used to enable upward heat dissipation, then thermal management improves, but device complexity increases
Solution Approach 1:
The leadframe structure serves multiple functions simultaneously: it provides mechanical support for the die, creates electrical connections through conventional leads, and enables upward heat dissipation through extended lead portions. The same leadframe components perform both electrical and thermal management functions, reducing the need for separate dedicated structures.
3Adaptability or versatility
If leads extend beyond package height, then stacking and thermal management improve, but manufacturing precision requirements increase
Solution Approach 1:
The leads are divided into distinct segments: inner portions embedded in the package and outer portions extending outside. This segmentation allows each portion to be optimized independently for its specific function while maintaining overall structural integrity and alignment during manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively enhances thermal dissipation capabilities, allowing for stable stacking and increased electrical performance, particularly in high-power applications, while maintaining cost-effectiveness and simplicity in manufacturing.
Implementation Method 1
a dissipation structure arranged between the die, facing the package surface... The dissipation structure is sometimes formed by the supporting structure (referred to as 'leadframe'), of metal, which carries the die
Implementation Method 2
A package of insulating material is included that has a parallelepipedal shape. The package surrounds the die and at least partially surrounds the die-attach support.
Data Source
AI summary
A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.