Stackable Tier Structure With Feedthrough Interconnects
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Solution Overview
Problem
Existing stackable microelectronic layer technologies face challenges in achieving high circuit density and low cost fabrication while maintaining a small form factor, as they require complex and costly processes to reroute I/O, power, and ground pads effectively.
Innovation Solution
The development of a stackable tier structure with integrated circuit die and area interconnect structures, where conductive traces reroute I/O, power, and ground pads to feedthrough structures, allowing for electrical connection between tiers and external circuitry, using conductive vias, metallized polymer columns, or stacked stud bumps, enabling efficient interconnection and high-density module formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex rerouting processes are used to connect I/O, power, and ground pads in stackable layers, then electrical connection reliability is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent divides the interconnection system into modular feedthrough structures that can be independently fabricated and then assembled. Each feedthrough structure contains pre-formed conductive elements (vias, bumps, or columns) that serve as discrete interconnection units, eliminating the need for complex continuous rerouting processes across entire layers.
Solution Approach 2:
The conductive interconnection elements are pre-formed within the feedthrough structures before the stacking assembly process. This preliminary formation of conductive paths allows for simplified subsequent assembly operations, as the electrical connections are already established in predetermined locations rather than requiring complex real-time routing.
2Reliability
If traditional interconnection methods are used, then electrical connectivity is achieved, but lead length increases causing higher parasitic impedance and longer electron time-of-flight
Solution Approach 1:
The patent transitions from planar two-dimensional interconnections to three-dimensional vertical interconnections by stacking multiple thin layers with feedthrough structures. This dimensional change allows electrical signals to travel through short vertical paths rather than long lateral paths, dramatically reducing lead length and associated parasitic effects.
Solution Approach 2:
The feedthrough structures contain nested conductive elements (such as vias within encapsulant material, or bumps within feedthrough structures) that create compact interconnection paths. This nesting arrangement minimizes the physical distance electrons must travel while maintaining reliable electrical connectivity between stacked layers.
3Productivity
If high density interconnections are implemented, then circuit density and I/O capacity increase, but manufacturing complexity and cost increase
Solution Approach 1:
The feedthrough structures serve multiple functions simultaneously: they provide mechanical support between layers, establish electrical connections, and define precise registration alignment features. This multi-functionality reduces the number of separate manufacturing steps needed, as a single feedthrough structure accomplishes what would otherwise require multiple separate processes.
Solution Approach 2:
The conductive interconnection elements are pre-formed within the feedthrough structures before the stacking assembly process. This preliminary formation of conductive paths allows for simplified subsequent assembly operations, as the electrical connections are already established in predetermined locations rather than requiring complex real-time routing.
4Adaptability or versatility
If more interconnection structures are added to increase I/O design capacity, then functionality improves, but the form factor increases
Solution Approach 1:
The patent transitions from planar two-dimensional interconnections to three-dimensional vertical interconnections by stacking multiple thin layers with feedthrough structures. This dimensional change allows electrical signals to travel through short vertical paths rather than long lateral paths, dramatically reducing lead length and associated parasitic effects.
Data Source
AI summary
A stackable tier structure comprising one or more integrated circuit die and one or more feedthrough structures is disclosed. The I/O pads of the integrated circuit die are electrically rerouted using conductive traces from the first side of the tier structure to a feedthrough structure comprising one ore more conductive structures. The conductive structures electrically route the integrated die pads to predetermined locations on the second side of the tier structure. The predetermined locations, such as exposed conductive pads or conductive posts, in turn, may be interconnected to a second tier structure or other circuitry to permit the fabrication of a three-dimensional microelectronic module comprising one or more stacked tiers.