Stackable Tray for IC Chips with Asymmetric Ridges
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Solution Overview
Problem
Existing stackable trays for integrated circuits, particularly BGA type, fail to provide adequate stabilization and protection in both orientations (right side up or upside down) and do not meet the requirements for mechanical, electrostatic, and electromagnetic protection, especially during automated assembly and inspection processes.
Innovation Solution
The trays feature upper and lower sides with support elements of uniform height for Z-direction stabilization and ridges for X-Y direction stabilization, with laterally offset ridges on one side of the tray stabilizing one pair of diagonally opposed corners and the other side stabilizing the adjacent pair, allowing for secure engagement in either orientation and conforming to JEDEC standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional stackable trays are used for storing integrated circuits, then storage capability is provided, but adequate stabilization and protection in both orientations (right side up or upside down) is not achieved
Solution Approach 1:
The tray employs asymmetric ridge structures where ridges on one side stabilize a first pair of diagonally opposed corners while ridges on the other side stabilize a second pair of diagonally opposed corners. This asymmetric configuration ensures that regardless of whether the tray is oriented right side up or upside down, the chips remain properly stabilized through the complementary ridge arrangements on opposite sides.
Solution Approach 2:
The invention adds dimensional complexity by implementing support elements with ledges of equal uniform height on both upper and lower sides of the tray. These ledges extend in the Z-direction (perpendicular to the floor) to restrain and stabilize chips vertically, while ridges provide stabilization in the X-Y direction (parallel to the floor), creating a three-dimensional stabilization system that works in all orientations.
2Reliability
If trays are designed with complex support structures for comprehensive protection, then mechanical and electrostatic protection is improved, but device complexity increases
Solution Approach 1:
The invention merges multiple protection functions into integrated structural elements. The support elements with ledges and ridges simultaneously provide mechanical support, electrostatic protection, and stabilization in both orientations. By combining these functions into unified ridge and ledge structures rather than separate components, the design achieves comprehensive protection while maintaining relatively simple tray construction.
Solution Approach 2:
The ridges and ledges serve multiple functions: they stabilize chips in the X-Y direction, restrain chips in the Z-direction, provide mechanical protection, and offer electrostatic shielding. This multi-functionality allows a single structural feature to address multiple protection requirements, reducing the need for additional separate protection mechanisms and thereby limiting complexity increases.
3Ease of manufacture
If uniform support elements are used on both sides of the tray, then manufacturing simplicity is maintained, but adequate stabilization in all orientations cannot be achieved
Solution Approach 1:
The tray implements local quality variations through ridges that are laterally inwardly offset on two diagonally opposing corners to define storage pockets and restrain chips, while ridges are laterally outwardly offset on the remaining two diagonally corners. This localized differentiation in ridge positioning provides precise stabilization for chips in specific orientations while maintaining overall manufacturing simplicity through consistent molding processes.
Data Source
AI summary
A stacking tray for electrical components, such as integrated circuits, particularly those of the ball grid array (BGA) type. The tray is stackable and includes an upper side and a lower side. Both upper and lower sides of the trays include support elements forming ledges and ridges to support the integrated circuit element and stabilize the integrated circuit element in the X-Y directions. In the unstacked configuration, whether the tray is presented in the right side up or upside down configuration, the integrated circuit elements are stabilized in the X-Y directions at two diagonally opposed corners, and hence all four sides of the chip. In a stacked configuration, the laterally inwardly offset ridges of a tray immediately downwardly adjacent from the integrated circuit restrain and stabilize the integrated circuit in the X-Y directions by engaging a first pair of diagonally opposed corners of the integrated circuit.