Stackable Treated Via Package Interconnection Balls

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Solution Overview

Problem

Inadvertent warpage in electronic component packages can lead to failure in solder interconnections during reflow, requiring rework or scraping of the assembly.

Innovation Solution

The method involves forming treated interconnection balls with flat or jagged surfaces to enhance bonding between stacked electronic component packages by flattening or deforming interconnection balls to create coplanar or roughened surfaces, respectively, which improve contact and bonding during the reflow process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional spherical interconnection balls are used, then manufacturing is simpler, but bonding reliability fails due to warpage-induced misalignment during reflow

Engineering Contradiction:

Improvebonding reliabilityVSAvoidinterconnection ball formation complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The interconnection balls are transformed from spherical to flattened or deformed shapes with modified surface parameters. This shape parameter change enables coplanar surfaces that maintain reliable bonding despite warpage, while the deformation process integrates into existing manufacturing workflows

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The interconnection balls are pre-flattened or pre-deformed before the stacking and reflow processes. This preliminary shaping action ensures that when packages experience warpage during assembly, the coplanar or roughened surfaces already exist to maintain bonding reliability under thermal and mechanical stress

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If coplanar flat surfaces are created on interconnection balls, then bonding contact is improved, but manufacturing process complexity increases

Engineering Contradiction:

Improvesurface coplanarityVSAvoidprocessing steps

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

Complex mechanical alignment systems are replaced by inherently coplanar interconnection ball surfaces. The flattened or deformed ball shapes self-align during stacking, eliminating the need for complex mechanical alignment fixtures or adjustment mechanisms while achieving precise coplanarity

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The surface geometry parameter of interconnection balls is changed from spherical to flattened/deformed with coplanar surfaces. This parameter modification achieves precise surface alignment through the inherent geometry of the deformed balls rather than requiring complex positioning systems

Inventive Principle:

Principle #35Parameter changes

3Reliability

If interconnection balls are flattened to create coplanar surfaces, then bonding reliability improves, but surface area for contact decreases

Engineering Contradiction:

Improvesolder interconnection reliabilityVSAvoidinterconnection ball surface area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The interconnection balls are deformed into asymmetric shapes with coplanar surfaces rather than maintaining symmetric spherical forms. This asymmetric deformation concentrates bonding surface area at the critical coplanar interface, ensuring reliable solder interconnections while the overall ball geometry adapts to compensate for any reduction in total surface area

Inventive Principle:

Principle #4Asymmetry

4Reliability

If rework or scraping is performed on failed assemblies, then defective connections are corrected, but productivity and manufacturing efficiency decrease

Engineering Contradiction:

Improvesolder interconnection reliabilityVSAvoidassembly throughput

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The interconnection balls are pre-flattened or pre-deformed with coplanar surfaces before assembly, ensuring that bonding reliability is established in advance. This preliminary preparation prevents solder interconnection failures from occurring in the first place, eliminating the need for subsequent rework or scraping operations that would reduce productivity

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The potential harm of warpage-induced bonding failures is converted into a benefit by pre-deforming the interconnection balls. The deformation that might seem to reduce surface area actually creates coplanar surfaces that are immune to warpage effects, turning the vulnerability into a strength that prevents failures and maintains high productivity

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach maximizes yield by ensuring reliable bonding between components, reducing the likelihood of solder interconnection failures and the need for rework.

Implementation Method 1

flattening or deforming interconnection balls to create coplanar or roughened surfaces

Methodology Applied

Scientific EffectDeformation: Deformation

Data Source

PatentUS8300423B1Stackable treated via package and method

Publication Date: 2012.10.30 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

A method of forming a stackable treated via package includes coupling interconnection balls to terminals. The interconnection balls are encapsulated in a package body. Via apertures are formed in the package body to expose the interconnection balls. The interconnection balls are treated to form treated interconnection balls comprising treated surfaces. The treated interconnection balls of the stackable treated via package enhance bonding with interconnection balls of a stacked electronic component package thus maximizing yield.