Stacked Acoustic Wave Resonators With Solid Mirror Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing acoustic wave filters face challenges in achieving high frequency resonance and power durability, particularly in laterally excited bulk acoustic wave resonators, due to heat dissipation and mechanical ruggedness issues, especially in high-frequency applications like 5G NR bands.
Innovation Solution
A stacked acoustic wave device assembly is introduced, featuring a laterally excited bulk acoustic wave resonator with a solid acoustic mirror between the piezoelectric layer and a support substrate, and a stacked structure that includes a silicon support substrate with high thermal conductivity to enhance heat dissipation and mechanical ruggedness, while maintaining high frequency resonance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a laterally excited bulk acoustic wave resonator is used for high frequency applications, then high frequency resonance is achieved, but heat dissipation and mechanical ruggedness deteriorate
Solution Approach 1:
The patent transitions from a planar two-dimensional resonator structure to a three-dimensional stacked configuration. By stacking multiple acoustic wave devices vertically with spacer assemblies between them, the design utilizes the vertical dimension to improve heat dissipation surface area and mechanical support, thereby enhancing power durability while maintaining high frequency resonance performance.
Solution Approach 2:
The patent employs composite material structures including piezoelectric layers combined with acoustic mirror layers, and substrate materials with high thermal conductivity. This composite approach allows the resonator to simultaneously achieve high frequency resonance through the piezoelectric effect while dissipating heat effectively through thermally conductive materials, resolving the contradiction between frequency performance and power durability.
2Reliability
If a solid acoustic mirror is added between the piezoelectric layer and support substrate, then heat dissipation and mechanical ruggedness improve, but device complexity increases
Solution Approach 1:
The solid acoustic mirror structure serves multiple functions simultaneously: it acts as an acoustic reflector to confine acoustic energy, provides thermal management by conducting heat away from the piezoelectric layer, and enhances mechanical support for the resonator structure. By integrating these multiple functions into a single component, the patent improves power durability without proportionally increasing device complexity.
3Temperature
If multiple acoustic wave devices are stacked vertically, then heat dissipation improves, but manufacturing complexity increases
Solution Approach 1:
The patent divides the acoustic wave device into modular segments that can be stacked vertically. Each device includes discrete components (piezoelectric layer, acoustic mirror, electrodes) that are fabricated separately and then assembled using spacer assemblies. This segmentation enables improved thermal dissipation through increased surface area while allowing for standardized manufacturing processes and modular assembly, thereby managing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves thermal dissipation and mechanical ruggedness, enabling high frequency resonance with desirable power durability, suitable for 5G NR and other high-frequency applications, and can be implemented in filters for radio frequency signals.
Implementation Method 1
a first solid acoustic mirror disposed between the first substrate and the first piezoelectric layer
Implementation Method 2
a stacked structure that includes a silicon support substrate with high thermal conductivity to enhance heat dissipation
Implementation Method 3
an interdigital transductor electrode on a piezoelectric substrate. The surface acoustic wave resonator can generate a surface acoustic wave on a surface of the piezoelectric layer
Data Source
AI summary
An acoustic wave device assembly is disclosed. The acoustic wave device assembly can include a first interdigital transducer electrode that is in contact with a first piezoelectric layer, and a second interdigital transducer electrode that is in contact with a second piezoelectric layer. The acoustic wave device assembly can include an acoustic mirror structure that is positioned between the first interdigital transducer electrode and the second interdigital transducer electrode. The acoustic mirror structure has a first portion that is configured to confine acoustic energy of a first acoustic wave generated by the first interdigital transducer electrode, and a second portion that is configured to confine acoustic energy of a second acoustic wave generated by the second interdigital transducer electrode.