Stacked Acoustic Wave Assembly With Solid Mirrors for Heat Dissipation
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Solution Overview
Problem
Existing acoustic wave resonators face challenges with heat dissipation and mechanical ruggedness, particularly in high-frequency applications such as 5G NR, leading to performance degradation and reliability issues.
Innovation Solution
Incorporating a solid acoustic mirror between the piezoelectric layer and the support substrate, which acts as an acoustic Bragg reflector, to confine acoustic energy and improve thermal dissipation while enhancing mechanical durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If acoustic wave resonators are used in high-frequency applications, then operating frequency is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by stacking multiple acoustic wave resonator devices vertically. This dimensional change allows heat to be dissipated through multiple pathways simultaneously, addressing the heat dissipation limitation in high-frequency applications without reducing operating frequency.
Solution Approach 2:
The patent introduces a heat dissipation layer as an intermediary component between the piezoelectric layer and the substrate. This intermediary layer specifically addresses thermal management by providing a dedicated thermal conduction pathway, allowing high-frequency operation to continue while improving heat dissipation capability.
2Speed
If acoustic wave resonators operate at high frequency, then frequency performance is improved, but mechanical ruggedness deteriorates
Solution Approach 1:
The patent employs composite material structures including the heat dissipation layer combined with piezoelectric materials and substrate materials. This composite approach creates a more mechanically robust structure that can withstand high-frequency operation stresses while maintaining the required frequency performance characteristics.
Solution Approach 2:
By stacking resonator devices vertically in three dimensions rather than arranging them horizontally, the patent creates a more mechanically rugged assembly structure. This vertical stacking with integrated heat dissipation layers provides structural reinforcement that improves mechanical ruggedness while preserving high-frequency operation capability.
3Temperature
If stacked acoustic wave device assembly is used, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The stacked acoustic wave device assembly is designed to perform multiple functions simultaneously: acoustic wave resonance, heat dissipation, and mechanical support. By integrating these functions into a single multi-functional assembly, the patent improves heat dissipation while managing device complexity through functional integration rather than separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively addresses heat dissipation and mechanical ruggedness issues, enabling high-frequency operation with improved power durability and reliability in 5G NR applications.
Implementation Method 1
Incorporating a solid acoustic mirror between the piezoelectric layer and the support substrate, which acts as an acoustic Bragg reflector, to confine acoustic energy
Implementation Method 2
a first piezoelectric layer on the first solid acoustic mirror, and a first interdigital transducer electrode in contact with the first piezoelectric layer
Data Source
AI summary
A stacked acoustic wave device assembly is disclosed. The stacked acoustic wave device assembly can include a first acoustic wave device including a first solid acoustic mirror on a first substrate, a first piezoelectric layer on the first solid acoustic mirror and a first interdigital transducer electrode in contact with the first piezoelectric layer. The stacked acoustic wave device assembly can include a second acoustic wave device including a second solid acoustic mirror on a second substrate, a second piezoelectric layer on the second solid acoustic mirror and a second interdigital transducer electrode in contact with the second piezoelectric layer. The stacked acoustic wave device assembly can include a third solid acoustic mirror positioned between the first acoustic wave device and the second acoustic wave device.