Stacked Acoustic Wave Substrates With Thermal Conduction Layer
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Solution Overview
Problem
Acoustic wave devices, such as SAW filters, face challenges with heat dissipation due to low thermal conductivity of their substrates, leading to localized heating and performance issues under varying temperatures.
Innovation Solution
A thermally conductive layer with higher thermal conductivity than the substrate material is applied on the surface of the acoustic wave device substrates, enhancing heat dissipation by creating a more efficient path for heat transfer through the frame and vias, thereby reducing operating temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If acoustic wave devices are used in radio frequency systems, then filtering and signal processing functions are achieved, but localized heating occurs due to low thermal conductivity of substrate materials
Solution Approach 1:
A thermally conductive layer is introduced as an intermediary between the acoustic wave devices and the substrate. This layer has higher thermal conductivity than the substrate material and serves as a heat transfer mediator, conducting heat away from the devices more effectively than the substrate alone could achieve.
Solution Approach 2:
The substrate structure is enhanced by combining the original substrate material with an additional thermally conductive layer, creating a composite structure. This composite approach leverages the electrical properties of the substrate while adding superior thermal conduction capabilities through the layered configuration.
2Object-generated harmful factors
If substrate materials with low thermal conductivity are used, then acoustic wave device functionality is maintained, but heat dissipation capability is insufficient
Solution Approach 1:
The thermally conductive layer acts as a heat transfer intermediary, positioned between the heat-generating acoustic wave devices and the low thermal conductivity substrate. It efficiently conducts heat away from the devices to external heat sinks or broader substrate areas, preventing localized thermal accumulation.
Solution Approach 2:
The thermal conductivity parameter of the substrate system is improved by adding the thermally conductive layer. This changes the thermal properties of the overall structure without altering the acoustic wave device functionality, allowing better heat dissipation while maintaining device performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation significantly decreases the operating temperature of the substrates, improving the performance and reliability of acoustic wave devices by effectively dissipating heat generated during operation.
Implementation Method 1
a thermally conductive layer disposed on a second surface of the first substrate opposite the first surface of the first substrate, the thermally conductive layer having a higher thermal conductivity than a material of which the first substrate is formed to reduce an operating temperature of the first substrate
Data Source
AI summary
An electronic device comprises a first substrate having a first surface bonded to a first surface of a second substrate, one or more acoustic wave devices disposed on the first surface of each of the first substrate and the second substrate, and a thermally conductive layer disposed on a second surface of the first substrate opposite the first surface of the first substrate. The thermally conductive layer has a higher thermal conductivity than a material of which the first substrate is formed to reduce an operating temperature of the first substrate.