Stacked AiP Radiator Structure for 28 GHz Bandwidth
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Solution Overview
Problem
The challenge in implementing a 5G millimeter-wave antenna in package (AiP) is the limited thickness, which restricts the vertical polarization of the end-fire antenna, resulting in a short current path and low bandwidth, failing to meet the bandwidth requirements for 5G millimeter-wave communication at 28 GHz frequency.
Innovation Solution
The antenna in package apparatus incorporates a first and second radiator connected by a metal piece, increasing the equivalent height and vertical polarization current path, enhancing the gain and bandwidth by distributing the current path across both radiators and metal pieces, and includes additional features like dual-polarized elements and coupling feeding to improve flexibility and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the antenna in package is limited to reduce device size, then the device miniaturization requirement is met, but the vertical polarization current path of the end-fire antenna becomes short and bandwidth is reduced
Solution Approach 1:
The patent transitions from a single-substrate two-dimensional antenna structure to a multi-substrate three-dimensional structure. The end-fire antenna is extended across multiple substrates connected by metal pieces, effectively increasing the vertical polarization current path in the thickness direction without increasing the planar footprint, thus resolving the contradiction between miniaturization and bandwidth requirements
Solution Approach 2:
The patent embeds multiple functional layers within a compact stacked configuration. The end-fire antenna structure is nested across multiple substrates with metal pieces connecting them, creating a compact vertical arrangement that maximizes the current path length within the limited thickness constraint, thereby maintaining bandwidth while achieving miniaturization
2Device complexity
If the thickness of the antenna in package is reduced, then device integration is improved, but the effective current path for vertical polarization is shortened
Solution Approach 1:
The patent utilizes the vertical dimension by extending the antenna structure across multiple substrates stacked in the thickness direction. This dimensional transition allows the effective current path to be extended vertically without increasing the planar area, thus maintaining integration while increasing the current path length
Solution Approach 2:
The patent divides the extended end-fire antenna into multiple segments located on different substrates. These segmented antenna elements are electrically connected through metal pieces, forming a continuous current path that spans multiple layers, thereby achieving both compact integration and extended effective current path
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the vertical polarization current path, thereby improving the gain and bandwidth of the antenna, effectively addressing the limitations of the prior art and meeting the bandwidth requirements for 5G millimeter-wave communication.
Implementation Method 1
a first radiator, a second radiator, a first feeding path, a first metal piece... the first feeding path is configured to feed the first radiator... the two radiators are connected by using the first metal piece disposed between the two substrates
Data Source
AI summary
This disclosure discloses implementations for high-bandwidth antenna in package (AiP) apparatuses. In an example, an AiP apparatus comprises: a first radiator, a second radiator, a first substrate, a second substrate, a first metal piece, and a first feeding path. The first radiator and the first feeding path are disposed on the first substrate, the second radiator is disposed on the second substrate, the first feeding path is configured to feed the first radiator, and the second radiator and the first radiator are connected using the first metal piece disposed between the first substrate and the second substrate.