Stacked Audio Amplifier Housing for Compact Heat Dissipation

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Solution Overview

Problem

Portable audio amplifiers face challenges in heat management, durability, and space efficiency, particularly in automotive applications, where they need to be powerful, rugged, and compact to avoid overheating and damage while providing high volume sound without distorting or damaging speakers.

Innovation Solution

A compact amplifier design with a housing that separates audio and power supply circuitry into upper and lower compartments, using thermal coupling and fins for heat dissipation, and mechanical bracing to reduce footprint and enhance cooling, allowing for efficient heat management and mechanical protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the amplifier is made compact to reduce trunk space, then space efficiency is improved, but heat dissipation becomes more difficult

Engineering Contradiction:

Improveamplifier footprintVSAvoidheat dissipation

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent transitions from a horizontal layout to a vertical stacked configuration, arranging circuit boards and heat-generating components in multiple vertical layers within the housing. This dimensional change allows the amplifier to maintain a compact footprint while providing sufficient vertical space for heat dissipation through the housing walls and dedicated heat sinks.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The amplifier interior is divided into multiple compartments with dedicated heat dissipation zones. Heat-generating components are segmented and positioned in specific areas with direct thermal coupling to the housing, while other areas serve different functions. This segmentation enables efficient heat management within the compact form factor.

Inventive Principle:

Principle #1Segmentation

2Reliability

If the amplifier is made rugged to withstand automotive environment, then durability is improved, but device complexity increases

Engineering Contradiction:

ImprovedurabilityVSAvoidstructural complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The housing serves multiple functions simultaneously: it provides mechanical protection against automotive vibrations and impacts, acts as a thermal management system through direct thermal coupling of components to the housing, and provides structural support for the stacked circuit board assembly. This merging of functions reduces the need for separate protective structures.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The housing is designed as a multi-functional component that combines mechanical protection, heat dissipation, and structural support. The same housing structure that protects against automotive environmental stresses also serves as the primary heat sink, eliminating the need for separate cooling structures and reducing overall device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Power

If high power output is achieved to provide high volume sound, then power is improved, but heat generation increases

Engineering Contradiction:

Improvepower outputVSAvoidheat generation

Core Design Contradiction:

PowerVSLoss of energy

Solution Approach 1:

The housing and heat sinks are thermally coupled to the power amplifier components, converting the harmful heat generated by high-power operation into a manageable thermal flow. The housing itself becomes the heat dissipation pathway, allowing the amplifier to deliver high power output while efficiently managing the inevitable heat generation through the vehicle's ambient air.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves effective heat dissipation and mechanical protection, reducing the amplifier's footprint while maintaining high power output, enabling installation in smaller spaces and preventing overheating, thus improving sound quality and durability.

Implementation Method 1

a housing (12) that dissipates heat

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

housing (12) that dissipates heat generated by the internal electronics

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

housing (12) has fins (14) on its exterior that dissipate heat

Methodology Applied

Scientific EffectHeat dissipation through extended surface area: Fin

Implementation Method 4

The upper circuit board is thermally coupled to the upper wall and the lower circuit board is thermally coupled to the divider

Methodology Applied

Scientific EffectThermal coupling: Conduction (thermal)

Data Source

PatentUS10076062B2Audio amplifier

Publication Date: 2018.09.11 WRIGHT NICHOLAS HEATH

AI summary

A amplifier with improved space efficiency includes a housing that dissipates heat having an upper wall and two side walls and having an interior with upper and lower portions. The amplifier further includes an upper circuit board in the upper portion and a lower circuit board in a lower portion. The amplifier further includes a connector that electrically connects the upper and lower circuit boards.