3D Stacked Antenna Structure for 5G Millimeter Wave Miniaturization

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Solution Overview

Problem

Conventional wireless communication modules with planar antenna structures face limitations in providing the necessary electrical functions for 5G systems due to restricted space on the substrate, making it difficult to meet the requirements for miniaturization and high-frequency antenna operations.

Innovation Solution

The electronic package features a carrier structure with a first antenna portion and a second antenna portion on a substrate, stacked via support members with air gaps to accommodate different signal frequencies, allowing for the production of 5G millimeter wave signals without increasing the module size, enabling the transmission and reception of required frequencies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a planar antenna structure is used on a substrate with fixed dimensions, then the module size can be reduced, but the space available for routing is limited and the functionality required for 5G systems cannot be provided

Engineering Contradiction:
Improvemodule sizeVSAvoidantenna functionality
Core Design Contradiction:
Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

The patent transitions from a planar two-dimensional antenna layout to a three-dimensional stacked configuration. Multiple antenna structures are arranged vertically on the substrate, utilizing the Z-axis dimension to accommodate multiple antenna elements and routing layers. This dimensional change allows sufficient routing space and antenna functionality while maintaining a compact footprint, resolving the contradiction between miniaturization and functional requirements.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If more layout areas are added onto the surface of the substrate to form antenna bodies for a plurality of frequencies, then the antenna can support multiple frequencies, but the width of the substrate increases making it difficult to reduce the width of the wireless communication module

Engineering Contradiction:
Improvefrequency coverageVSAvoidsubstrate width
Core Design Contradiction:
Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

Instead of expanding antenna layouts horizontally to support multiple frequencies, the patent stacks multiple antenna structures vertically. Different antenna elements operating at different frequencies are arranged in the vertical dimension, allowing multi-frequency support without increasing substrate width. This vertical stacking enables frequency diversity while maintaining compact module dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs a nested arrangement where multiple antenna structures are integrated within a compact vertical space. Smaller antenna elements are positioned within or adjacent to larger ones in the vertical stacking configuration, allowing multiple frequency antennas to coexist in a confined area without requiring additional horizontal layout space.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Volume of moving object

If the substrate dimensions are fixed, then the module can be miniaturized, but there is only a limited space available for routing which restricts the functionality of the antenna structure

Engineering Contradiction:
Improvemodule sizeVSAvoidrouting space
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent utilizes vertical stacking to create additional routing space in the Z-axis direction. Multiple signal layers and grounding structures are arranged vertically, providing sufficient routing pathways without increasing the horizontal substrate area. This three-dimensional routing architecture enables complex antenna functionality within a miniaturized footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11271313B2Electronic package and method for manufacturing the same
Publication Date: 2022.03.08 SILICONWARE PRECISION IND CO LTD
  • US11271313B2 patent drawing
  • US11271313B2 patent drawing
  • US11271313B2 patent drawing

AI summary

An electronic package and a method for manufacturing the same are provided, where at least one substrate structure having a second antenna portion is disposed on a carrier structure having a first antenna portion, and then an antenna structure having a first antenna body and a second antenna body is stacked on the carrier structure by a plurality of supporting members to cover the first antenna portion and the second antenna portion, so that the first antenna body corresponds to the first antenna portion, and the second antenna body corresponds to the second antenna portion. The substrate structure is disposed on the carrier structure to generate 5G millimeter waves of different frequencies, such that the antenna structure can generate different antenna signals based on needs.