Stacked Antenna Module Layout for Heat Dissipation and Signal Isolation
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Solution Overview
Problem
Existing antenna modules face challenges in reducing size, improving communication characteristics, and enhancing heat dissipation.
Innovation Solution
The antenna module design includes a first and second circuit board configuration with an electrically connecting member, a semiconductor integrated circuit, and metal cases that form a heat conductive path to efficiently dissipate heat while maintaining effective communication, allowing for reduced size and improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the antenna module uses a conventional single-layer circuit board design, then the structure is simple, but the size cannot be reduced and heat dissipation is poor
Solution Approach 1:
The patent transitions from a conventional single-layer planar circuit board to a three-dimensional stacked configuration with first and second circuit boards arranged in the up-down direction. This vertical stacking enables space utilization in the thickness dimension, achieving size reduction while providing separate layers for antenna placement and electronic component mounting, thus resolving the contradiction between compactness and functional integration.
Solution Approach 2:
The circuit board is segmented into functionally independent first and second circuit boards. The first circuit board is dedicated to antenna mounting while the second circuit board hosts electronic components. This segmentation allows optimized thermal management and electromagnetic performance while maintaining a compact overall structure, addressing both size reduction and functional requirements.
2Temperature
If heat dissipation structures are added to the antenna module, then heat dissipation improves, but the device complexity and size increase
Solution Approach 1:
The patent integrates heat dissipation functionality directly into the existing multi-layer circuit board structure and metal housing without adding separate heat dissipation components. The second circuit board serves dual purposes as both an electronic component carrier and a heat dissipation structure, while the metal housing provides both mechanical protection and thermal conduction pathways. This merging approach achieves effective heat dissipation while avoiding increased device complexity.
Solution Approach 2:
The metal housing and circuit boards are designed to perform multiple functions simultaneously: structural support, electromagnetic shielding, electrical connection, and heat dissipation. This multi-functionality eliminates the need for dedicated heat dissipation components, reducing overall device complexity while maintaining effective thermal management.
3Reliability
If the antenna and electronic components are mounted on the same circuit board, then the structure is compact, but communication characteristics deteriorate due to interference
Solution Approach 1:
The patent physically separates the antenna system on the first circuit board from the electronic components on the second circuit board. This spatial segmentation in the vertical direction minimizes electromagnetic interference between high-frequency antenna signals and digital electronic circuits, thereby improving communication reliability without requiring complex shielding or filtering circuits.
Solution Approach 2:
By utilizing the vertical dimension with stacked circuit boards, the patent achieves physical separation of antenna and electronic components without increasing the planar footprint. This three-dimensional arrangement maintains compactness while improving electromagnetic compatibility, resolving the contradiction between compact integration and communication performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the antenna module's size, enhances communication capabilities, and improves heat dissipation by allowing direct heat conduction through solid paths, ensuring efficient heat transfer without obstructing electromagnetic wave transmission.
Implementation Method 1
a heat conductive path through which heat is conducted is provided between the first circuit board and the second circuit board and is a path that passes through a solid including the first metal case
Implementation Method 2
an antenna that is configured to transmit and/or receive an electromagnetic wave or a magnetic field
Data Source
AI summary
An antenna module is provided that includes a first circuit board that includes an antenna that transmits and/or receives an electromagnetic wave or a magnetic field, a second circuit board that faces the first circuit board and when viewed in an up and down direction and overlaps with the first circuit board, an electrically connecting member that electrically connects the first circuit board to the second circuit board. A semiconductor integrated circuit is provided and a first metal case covers the semiconductor integrated circuit. The first metal case and the semiconductor integrated circuit are both mounted either a first lower main surface or a second upper main surface. A heat conductive path conducts heat between the first circuit board and the second circuit board and passes through a solid including the first metal case.