Stacked Multi-Plane Antenna for Compact High-Gain Integration
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Solution Overview
Problem
Existing consumer electronics devices face challenges in maintaining reliable and stable radio signal connections due to miniaturized antennae performance degradation in real-world environments, especially with high-bandwidth applications and cellular signal loss in vehicles.
Innovation Solution
A dual-plane antenna design with symmetrical conducting lands and insulating gaps, allowing for high gain and low profile integration in various environments, offering two modes of operation for wider or narrower bandwidths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the antenna footprint is reduced to assist with integration into the automobile, then the ease of integration is improved, but the superior performance characteristics (signal gain) are worsened
Solution Approach 1:
The patent transitions from a conventional planar antenna design to a three-dimensional stacked configuration with multiple conducting lands arranged in separate planes (first plane with first lands, second plane with second lands, third plane with third lands, fourth plane with fourth lands). This vertical stacking enables the antenna to achieve high signal gain performance while maintaining a compact footprint suitable for automobile integration, effectively resolving the contradiction between integration ease and performance.
Solution Approach 2:
The patent implements a nested structure where multiple conducting lands are arranged in stacked planes with each plane containing lands that are spatially nested or offset from corresponding lands in adjacent planes. The conducting lands in different planes are positioned to create overlapping or nested projection patterns when viewed from above, maximizing the effective radiating area within a compact vertical envelope, thereby achieving high gain without increasing horizontal footprint.
2Volume of moving object
If conventional miniaturized antennae are used in consumer electronics, then the device portability is improved, but the signal reception reliability is worsened in real-world environments
Solution Approach 1:
The patent employs a multi-plane stacked configuration where conducting lands are distributed across four separate planes spaced at specific distances (e.g., 0.5-2.0 inches between planes). This vertical dimensionality allows the antenna to achieve equivalent or superior performance to much larger planar antennas while maintaining a compact overall volume suitable for mobile devices, thereby resolving the contradiction between miniaturization and reception reliability.
Solution Approach 2:
The patent utilizes a composite structure combining multiple conducting lands made of conductive materials (such as copper, aluminum, or conductive polymers) arranged in specific geometric patterns across multiple planes. The composite arrangement of these conducting elements, separated by insulating materials, creates a synergistic effect that enhances signal reception performance beyond what could be achieved with a single planar element of comparable size, thus maintaining miniaturization while improving reliability.
Data Source
AI summary
The antenna includes a pair of electrically conducting first lands and a pair electrically conducting second lands disposed in a first plane. The antenna includes an antenna feed mechanism for the pair of first electrically conducting lands; and a third conducting land in a second plane parallel to the first plane. The antenna also includes a fourth conducting land in a third plane substantially parallel to both the first plane and the second plane, offset from both first plane and the second plane with the second plane located between the first and third planes.