Stacked Antenna Module Insulation Reduces Interference

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Solution Overview

Problem

Conventional portable electronic devices with stacked antenna modules often experience interference between top and bottom antenna structures, leading to reduced performance and signal clarity.

Innovation Solution

A stacked antenna module design featuring a first antenna structure with a carrier substrate, insulating connection layers, and a second antenna structure with feeding pins passing through the substrate without contacting the surrounding insulation layer, which reduces interference and enhances signal clarity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a stacked antenna module with top and bottom antenna structures is used, then wireless transmission capability is improved, but interference between antenna structures occurs leading to degraded signal quality

Engineering Contradiction:
Improvewireless transmission capabilityVSAvoidinterference between antenna structures
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

An insulating connection layer is introduced between the first and second antenna structures to serve as an intermediary that provides electrical insulation while maintaining mechanical connection. This mediator prevents direct electrical contact between the stacked antenna structures, thereby reducing interference while preserving the compact stacked configuration for improved wireless transmission capability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The antenna module is segmented into distinct first and second antenna structures with separate carrier substrates, each having its own feeding pins and electrode layers. This segmentation allows independent optimization of each antenna structure while maintaining physical separation through the insulating connection layer, reducing mutual interference between the stacked structures.

Inventive Principle:
Principle #1Segmentation

2Reliability

If feeding pins directly contact the antenna electrode layers, then electrical connection is achieved, but interference model increases and signal clarity decreases

Engineering Contradiction:
Improveelectrical connectionVSAvoidsignal clarity
Core Design Contradiction:
ReliabilityVSLoss of information

Solution Approach 1:

The insulating connection layer acts as an intermediary between the feeding pins of the first antenna structure and the electrode layers of the second antenna structure. It provides the necessary electrical connection path while preventing direct contact that would cause interference, thereby maintaining signal clarity while ensuring reliable electrical connectivity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The insulating connection layer is a simple, cost-effective component that provides temporary electrical insulation during the signal transmission process. This disposable-like insulating element effectively blocks interference paths without requiring complex active components, maintaining signal integrity at low cost.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Data Source

PatentUS10637145B2Stacked antenna module
Publication Date: 2020.04.28 INPAQ TECHNOLOGY CO LTD
  • US10637145B2 patent drawing
  • US10637145B2 patent drawing
  • US10637145B2 patent drawing

AI summary

The present invention provides a portable electronic device and a stacked antenna module thereof. The stacked antenna module includes a first antenna structure and a second antenna structure stacked on the first antenna structure and insulated from the first antenna structure. The first antenna structure includes a first carrier substrate having at least one through hole, a surrounding insulation layer disposed inside the at least one through hole, and a first feeding pin passing through the first carrier substrate. The second antenna structure includes a second carrier substrate and a second feeding pin passing through the second carrier substrate, and the second feeding pin passes through the surrounding insulation layer without contacting the surrounding insulation layer.