Stacked Antenna Module Feed Layout for Compact mmWave RF
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Solution Overview
Problem
Existing antenna designs struggle to effectively transmit and receive millimeter waves under the new radio (NR) environment, leading to signal attenuation and degradation in high frequency bands like mmWave, particularly in mobile applications where spatial efficiency is crucial.
Innovation Solution
The antenna module comprises multiple antenna patches stacked in parallel, with power feed lines penetrating through specific regions to minimize interference, allowing simultaneous support for multiple frequency bands and polarizations, including millimeter-wave signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If antenna size is reduced for spatial efficiency in mobile devices, then device compactness is improved, but signal transmission quality in mmWave bands deteriorates
Solution Approach 1:
The patent transitions from planar 2D antenna patches to three-dimensional stacked patches arranged vertically. Multiple antenna patches are positioned at different heights (first patch at reference level, second patch elevated by first distance, third patch elevated by second distance), creating a 3D spatial structure that maintains electrical performance while reducing footprint area.
Solution Approach 2:
The patent implements a nested stacked configuration where multiple antenna patches are vertically integrated within a compact volume. The first, second, and third antenna patches are arranged in overlapping vertical projections, with feed lines penetrating through intermediate patches to reach target patches, creating a space-efficient nested structure.
2Adaptability or versatility
If power feed lines penetrate through antenna patches to connect stacked elements, then multi-layer connectivity is improved, but electric field interference and signal loss increase
Solution Approach 1:
The patent applies different characteristics to different regions of the antenna structure. Feed lines penetrating through antenna patches are designed with specific impedance control and positioning strategies - passing through regions of low electric field intensity or using localized grounding structures - to minimize interference while maintaining connectivity between stacked patches.
Solution Approach 2:
The patent introduces intermediate structural elements such as grounding planes, dielectric layers, and optimized feed line configurations that act as mediators between stacked antenna patches. These intermediary structures manage electromagnetic coupling and reduce harmful interactions while enabling vertical connectivity.
3Adaptability or versatility
If multiple antenna patches are stacked vertically to support multi-band operation, then frequency band coverage is improved, but device height increases
Solution Approach 1:
The patent utilizes the vertical dimension to accommodate multiple antenna patches for different frequency bands (first patch for first band, second patch for second band, third patch for third band). By stacking patches vertically rather than arranging them horizontally, the design achieves multi-band capability while minimizing the horizontal footprint, though vertical height increases.
Solution Approach 2:
The patent combines multiple antenna patches and their associated feed lines into a single integrated stacked structure. Multiple functional elements (different frequency band antennas, ground planes, dielectric layers) are merged into one compact module that can be mounted in a single location, reducing overall device space requirements despite the vertical stacking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient, miniaturized antenna modules that support multi-band and multi-polarization capabilities, reducing signal attenuation and enhancing performance in mmWave frequency bands while maintaining spatial efficiency.
Implementation Method 1
a first antenna patch disposed above the ground plate to be in parallel with the ground plate and comprising a first penetration point, and a first power feed point connected to a first power feed line to radiate first electromagnetic waves corresponding to a first frequency band
Implementation Method 2
a second antenna patch disposed above the first antenna patch to be in parallel with the first antenna patch and comprising a second power feed point connected to a second power feed line penetrating through the first penetration point; and a third antenna patch disposed above the second antenna patch to be in parallel with the second antenna patch, wherein the second antenna patch and the third antenna patch are configured to radiate second electromagnetic waves corresponding to a second frequency band
Data Source
AI summary
A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.